BGA Rework Equipment

 

The BGA rework equipment is an optical alignment BGA rework station DH-A6 that used in laptop motherboard repair and smartphone PCB repair and a wide range of electronic component rework. Equipped with three independent temperature zones(top heater, bottom heater and infrared preheating zone), HD touch screen,optical alignment CCD camera, laser positioning pointer, cross-flow cooling fan, HD display, and an automatic vaccum pickup device. Ensuring accurate alignment and reliable rework performance.

 

Application industries for optical alignment BGA rework station:

1. Consumer Electronic Manufacturer: smartphone PCB repair, laptop motherboard repair, gaming consoles (PS, Xbox);

2. Computer & IT Hardware: graphics cards (GPU repair), CPU sockets and chipset BGA packages;

3. Automotive Electronics: ECU (Engine Control Unit), ADAS control modules, Automotive sensors and controllers;

4. Industrial Control & Automation: PLC control board, inverter and motor control PCBs, industrial robots and machinery PCBs;

5. Medical Electronis: imaging device control boards, patient monitoring systems;

6. Repair Centers & Technical Service Shops: motherboard repair shops, mobile phone repair centers, professional PCB repair business;

7. Education & Research Institutions: university electronics laboratories, R & D centers, Microelectronics teaching and training facilities;

8. Aerospace & Defense Electronics: radar and navigation control modules, communication equipment;

9. EMS / OEM / ODM Factories: electronics manufacturing services (mass production line rework), prototype development and engineering labs.

 

 

 

 

 

 

 

 

Item	Parameter
Power Supply	AC220V±10％ 50/60Hz
Total Power	11000W
Top heater	1200W
Bottom heater	1200W
IR preheating area	8000W
Operation mode	Fully automatically disassemble,suction,mounting and soldering
Chip feeding system	Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage	50000 groups
Temperature control	K-type Sensor,Closed loop and 8~20 segments for temperature controlling program
Temperature accuracy	±2 ℃
Placement Accuracy	+/-0.01mm
Safety guard	pressure sensor +emergency knob,double-guard
PCB size	Max700*620 mm Min 22*22 mm
Net weight	150kg
BGA chip	2x2-65*65mm
Minimum chip spacing	0.15mm
External Temperature Sensor	5 pcs(optional)
Machine type	Desktop table (optional)
Dimensions	L1050*W1130*H1070 mm

 

 

 

 

1. High-definition touchscreen interface, PLC control, and instantaneous curve analysis function. Real-time display of set and measured temperature curves, with the ability to analyze and correct the curves.

 

2. Employs a stepper motion control system: stable, reliable, safe, efficient, and highly automated; utilizes a high-precision digital image alignment system; the PCB board positioning uses a V-groove and linear slide, allowing for fine-tuning or rapid positioning along the X, Y, and Z axes-convenient, accurate, and suitable for different PCB layouts and PCB sizes.

 

3. A flexible and convenient movable universal clamp protects the PCB board, preventing damage to edge components and PCB deformation, and accommodates rework of various BGA package sizes.

 

4. Equipped with various sizes of alloy air nozzles, which can rotate 360 degrees for easy installation and replacement.

 

5. Each upper and lower heating zone can be set with 8 temperature segments. A large number of temperature curves can be stored and retrieved for different BGAs. Curve analysis, setting, and correction can also be performed on the touchscreen.

 

6. The three heating zones use independent PID algorithms to control the heating process, resulting in more uniform and accurate heating.

 

7. A high-power cross-flow cooling fan rapidly cools the PCB board to prevent deformation, enabling intelligent automated control of the mounting, soldering, and disassembly processes.

 

8. A voice-activated "early warning" function alerts operators 5-10 seconds before disassembly or soldering is complete. After the upper and lower hot air stops heating, the cooling system activates and automatically stops cooling once the temperature drops to room temperature. This prevents the machine from aging after overheating.

 

9. Features material receiving and feeding functions, making machine operation simpler, more convenient, and improving efficiency.