Optical Macbook BGA Rework Station
1. Automatically solder, desolder and mount BGA IC chip with optical alignment system and 3 heating area.
2. High success rate of repairing.
3. Suitable for PCB size:Max450*490,Min22*22mm.
4. Suitable for Chip size:80*80-1*1mm
Description
1. Application
Suitable for different PCBs.
The motherboard of computers, smartphones, laptops, MacBook logic boards, digital cameras, air conditioners, TVs, and othe devicesr
electronic equipment from the medical industry, communication industry, automobile industry, etc.
Suitable for different kind of chips: BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.
2. Product Features
• Desoldering, mounting and soldering automatically.
•The high success rate of repairing chip and PCB.
•The machine won't damage to surrounding components around the target chip on PCB due to strict temperature control.
• Precise optical alignment system
zoom in/out and micro-adjust, equipped with an aberration detection device, with autofocus and software operation
• Three independently controlled heaters. it can heat the PCB board and BGA chips at the same time. And the third IR heater
can preheat the PCB board from the bottom evenly, to avoid PCB deformation during the repair process. All three heaters
can heat independently. The top and bottom heaters are hot-air heaters, the third is an infrared preheating zone.
3. Specification
| Power | 5300W |
| Top heater | Hot air 1200W |
| Bottom heater | Hot air 1200W. Infrared 2700W |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | K type thermocouple, closed loop control, independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm, Min 22＊22 mm |
| Workbench fine-tuning | ±15mm forward/backward.+15mm right/left |
| BGA chip | 80＊80-1＊1 mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1 (optional) |
| Net weight | 70kg |
4. Details of Optical MacBook BGA Rework Station
- CCD camera( precise optical alignment system) ;
- HD digital display ;
- Micrometer (adjust the angle of a chip) ;
- 3 independent heaters ( hot air & infrared ) ;
- Laser positioning ;
- HD touchscreen interface , PLC control ;
- LED headlamp ;
- Joystick control.
5. Why Choose Our Optical MacBook BGA Rework Station?
6. Certificate
To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD was the first to pass UL,
E-MARK, CCC, FCC, CE ,ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed
ISO, GMP, FCCA, and C-TPAT on-site audit certification.
7. Packing & Shipment
8. Contact us
Email: john@dh-kc.com
WhatsApp/Wechat/Mob:+86 157 6811 4827
9. FAQ
Q1: Will the top head of the machine fall down to fast and then break the chip and PCB?
A1: To protect the PCB and chip from being crushed, there is a built-in pressure testing device in a mounting head.
Once the pressure testing device detects any pressure, the top head of the machine will stop automatically.
Q2:During the heating process, the temperature is very high. After the heating process is finished, do I need to pick a chip on PCB?
A2: Built-in vacuum in the mounting head pick up BGA chip automatically after desoldering is completed.
Q3:What happens if the chip is dropped down on the heating area accidentally? Will it be too hard to take it out? Will it be burnt?
A3:The infrared preheating area is covered by steel mesh. This is to prevent chips from falling down in the hot heating area.
