Touch Screen Camera BGA Rework Station

                                                        Touch Screen Camera BGA Rework Station

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Promotional Price! The DH-A1L BGA Rework Machine, equipped with an HD touch screen, is now in stock.

DH-A1L BGA Rework Station Features:

1. High success rate for chip repairs.
2. Precise temperature control.
3. No false soldering or poor solder joints.
4. Three independent heating areas.
5. User-friendly design.
6. Sound notification system.
7. Powerful cross-flow fan.
8. Efficient cooling system.

We are committed to BGA rework and automatic machinery, covering most of India, Europe, and the American market. We look forward to becoming your long-term partner in China.

1. Specification

1	Power	4900W
2	Top heater	Hot air 800W
3	Bottom heater	Hot air 1200W, Infrared 2800W
4	Iron heater	90w
5	Power supply	AC220V±10%50/60Hz
6	Dimension	640*730*580mm
7	Positioning	V-groove,PCB support can be adjusted in any direction with an external universal fixture
8	Temperature control	K-type thermocouple, closed-loop control, independent heating
9	Temp accuracy	±2 degrees
10	PCB size	Max500*400 mm Min 22*22 mm
11	BGAchip	2*2-80*80mm
12	Minimum chip spacing	0.15mm
13	External Temperature Sensor	1(optional)
14	Net weight	45kg

2. Main Features of the DH-A1L BGA Rework Station

Scientific & Smart

1. The station has 3 independent heating areas: hot-air heaters and an IR preheating area, which heat stably and quickly while preventing PCBA deformation.
2. The top heater air volume, bottom heater height, and IR preheating area can be adjusted to suit different types of BGA repairs.
3. Equipped with various sizes of titanium alloy BGA nozzles, which can rotate 360 degrees for easy placement and replacement.
4. It allows setting 6 temperature rise segments and 6 constant temperature segments, and can store multiple temperature profiles for use at any time.

3. Why you should choose the DH-A1L BGA rework station?

4. Related Knowledge:

Surface mount land preparation should be performed before installing or replacing a new surface mount component. Avoiding thermal and/or mechanical damage to the land and substrate is critical. The two primary steps include:

• Remove Old Solder

This can be done with a soldering iron and braided solder-wicking material, or with a continuous vacuum Flo Desoldering technique that uses a solder extractor and a special Flo-D-Sodr tip. This method allows the reflow and vacuum removal of the old solder to occur continuously.

• Clean Lands

Old flux residues left after removing the old solder must be cleaned in this step before adding new solder.

• Add New Solder

This step is part of the component installation process and can be accomplished by either pre-filling (pre-tinning) the lands (by reflowing wire solder with a soldering iron or another heating method), or by applying solder paste (cream) with a dispenser before (or after) the component is placed on the land pattern.

The amount of solder applied is critical for achieving acceptable joints. For instance, acceptable J-lead solder joints require much more solder than acceptable gull-wing lead solder joints.

Surface Mount Components:

• Pre-/Auxiliary Heat Assembly and/or Component (if required)
• Apply heat evenly and rapidly in a controllable manner to achieve complete, simultaneous reflow (melting) of all solder joints.
• Avoid thermal and/or mechanical damage to the component, board, adjacent components, and their joints.
• Remove the component from the board immediately before any solder joint re-solidifies.
• Prepare lands for the replacement component.

Thru-Hole Components:

Desoldering Component One Joint at a Time Using the Continuous Vacuum Method

• Pre-/Auxiliary heat assembly and/or component (if required).
• Heat the joint rapidly and controllably to achieve complete solder reflow.
• Avoid thermal and/or mechanical damage to the component, board, adjacent components, and their joints.
• Apply vacuum during lead movement to cool the joint and free the lead.

Desoldering Component Using the Solder Fountain Method

• Reflow all joints in the solder fountain.
• Remove the old component and either immediately replace it with a new component or clear the thru-holes for later component replacement.

5.Detailed Images of DH-A1L BGA REWORK STATION

6.Packing & delivery details of DH-A1L BGA REWORK STATION

   

Delivery detials of DH-A1L BGA REWORK STATION

Shipping:

1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.

7. FAQ

Q: How to distinguish between leaded and lead-free chips?

A: Distinguish from the surface of the chip printing. Such as the Intel series south bridge, FW82801DBM NH82801DBM,

 the former is leaded, and the latter is lead-free, with FW and NH being the difference.

2.RoHS-labeled on the device or on the PCB are lead-free certified products.

3. RoHS scope: Only for new products launched after July 1, 2006. Basically, motherboards and notebooks produced after 

2007 are all lead-free.