BGA Chip Soldering And Desoldering Machine

 

The DH-5880 is a professional manual BGA rework station built for technicians who need reliable, repeatable results across a wide range of chip sizes and board types - covering everything from small mobile phone chips to large server motherboards. It is a non-optical machine - meaning the operator works with direct hand control and profile-driven automation rather than a camera alignment system - which makes it well suited to experienced repair technicians in mobile phone workshops, laptop service centres, and small-batch production environments where speed and process consistency matter more than optical verification.

 

What sets this machine apart from basic hot air stations is its three-zone independent heating architecture. A top hot air heater, a secondary bottom infrared heater, and a large-area IR preheating plate work together to control the thermal environment of the entire board - not just the chip being reworked. The DH-5880 gives the operator full control over every segment of the reflow profile while the machine handles the precision of maintaining those temperatures with ±2°C accuracy via K-type thermocouple closed-loop PID control. Four independent external temperature sensors can be connected simultaneously, letting the operator monitor actual board surface temperatures at multiple points in real time - a capability that moves this machine well beyond the standard single-sensor machines found at the same price point.

 

 

 

 

 

As a daily-use manual BGA rework station, the DH-5880 is the right choice for:

 

 Mobile phone and laptop repair workshops operating a high-volume BGA chip soldering and desoldering machine - handling CPU, GPU, NAND, Wi-Fi, power management ICs across a wide range of consumer devices

 Game console repair - PS4, PS5, Xbox GPU and HDMI chip rework, where board size and chip heat sensitivity demand reliable bottom preheating

 ASIC hash board repair - bitcoin mining board chip rework, where large board formats and high-density chips require wide-area infrared preheating

 R&D labs and small production lines that need reproducible temperature profiles stored by job and recalled instantly

 Macbook and desktop motherboard service - where board quality is high and thermal management must be controlled precisely to avoid lifting pads or damaging sensitive passives

 

The chip size range of 2×2 mm to 80×80 mm and PCB acceptance up to 450×380 mm means the DH-5880 handles nearly every board format encountered in real workshop conditions, from tiny embedded modules to full-size desktop and server motherboards.

 

 

 

 

1. Three-Zone Independent Heating System

 

The DH-5880 is fundamentally an infrared BGA rework station in its approach to bottom heating - and that is by design. The three heating zones work in a deliberate sequence:

 

Zone	Type	Power	Role
Top heater	Hot air	1200W	Directly reflows the target BGA chip
Bottom heater - Zone 2	Hot air infrared	1200W	Local board preheating beneath the chip area
Bottom heater - Zone 3	Large-area IR preheating	3000W	Full-board thermal soak before top heat activates

 

The steel-mesh guard over the infrared preheating area is a practical detail that separates this machine from its predecessor (the DH-5860). It protects components near the board edges from direct IR exposure during the preheat phase, which matters when you are working on boards like Macbooks or laptop mainboards where components sit densely across the entire PCB surface.

Each zone is independently PID-controlled. The result is that the board arrives at a stable soak temperature from the bottom before the top heater ever fires - the correct way to do BGA rework, and the approach that produces the fewest cold joints, the least PCB warpage, and the lowest rate of collateral component damage.

 

2. Four Independent Temperature Sensors

 

Most machines in this category give you one or two temperature reading points. The DH-5880 supports four independent external temperature sensors, expandable and optional, which can be positioned at different locations across the PCB surface simultaneously. This is not a minor specification - it is the difference between trusting that your profile is working and actually verifying it.

For technicians running a BGA chip soldering and desoldering machine on high-value boards - Macbooks, server motherboards, hash boards - the ability to see real temperature readings at four independent points in real time means you can catch a thermal imbalance before it becomes a damaged pad or a cracked capacitor.

 

3. HD Touch Screen with 50,000 Profile Storage

 

The DH-5880 runs on a touch screen interface connected to an embedded controller. The screen shows live temperature curves for all three heating zones simultaneously, plotted against the programmed target profile in real time. Operators can set up to multiple profile segments covering ramp rate, soak temperature, peak temperature, hold time, and cooling rate.

The machine stores 50,000 temperature profile groups. For a busy workshop handling many different board models, this is not an exaggerated number - it is the practical number needed to maintain a dedicated profile for every common model that comes in for repair, recalled by name at a tap.

 

4. Laser BGA Positioning

 

Without an optical CCD camera system, the DH-5880 uses laser centre-point positioning to help the operator place the BGA chip accurately over the pad before reflow. The laser marks the exact centre of the target pad, allowing precise manual placement of the chip before the reflow cycle begins.

This approach works well for experienced technicians who are already comfortable with chip placement - and it keeps the machine's footprint, complexity, and cost lower than optical alignment systems without sacrificing the accuracy that matters in practice.

 

5. V-Groove Bracket and Universal Fixture

 

The PCB is held using a combination of a V-groove slot, a 5-point adjustable support platform, and a universal fixture adjustable in the X direction. This three-component system handles boards of very different sizes and thicknesses without applying uneven mechanical stress to the PCB - an underrated factor in preventing trace damage during heat cycles. The minimum supported PCB size is 10×10 mm and the maximum is 450×380 mm.

 

6. Built-in Vacuum Suction Pen

 

After the desoldering cycle, the operator uses the built-in vacuum suction pen to lift the chip cleanly from the board. The pen prevents any need to touch the chip with tweezers or fingers during the critical window when the solder balls are still at reflow temperature, protecting both the ball grid and the PCB pad from mechanical interference at the worst possible moment.

 

 

 

 

The DH-5880 is built to handle the full range of tasks a professional repair workshop encounters:

 

 Laptop motherboards - CPU, GPU, memory chips on all major brands

 Smartphone motherboards - AP, baseband, power management BGA packages

 Game consoles - PS4/PS5 GPU, Xbox GPU and related chip rework

 Desktop and server motherboards - large-format boards including full ATX

 ASIC hash boards - bitcoin mining board chip replacement

 Macbook mainboards - where thermal precision and pad protection are critical

 Industrial and automotive control boards - where lead-free profiles must match chip manufacturer specs exactly

 Telecom and networking boards - large PCBs with dense BGA populations

 

Compatible packages include: BGA, PBGA, CBGA, LGA, QFN, QFP, CSP, PoP, DMA, SMT components of all standard pitches.

 

 

 

 

Item	Parameter
Total Power	5500w
Top heater	1200w
Bottom heater	1200w ( the second temperature zone)
Infared heater	3000w ( the third temperature zone)
Operation mode	Touch screen+manual
Dimensions	L500*W600*H700mm
Temperature profiles storage	50000 groups
PCB positioning	V-groove + universal fixture + 5-points support + Adjustable in X direction
BGA positioning	Laser pointing at its center
Temperature control	K-type Thermocouple + Closed Loop + Auto compensation
Temperature accuracy	±2℃
PCB size	Max 450*380mm Min 10*10mm
BGA size	1*1-80*80mm
BGA absorption mode	Vacuum suction pen
Minimum chip spacing	0.1mm
External temperature sensor	4, optional
Machine type	desktop
Net weight	48kg

 

 

 

 

The DH-5880 is a well-rounded infrared BGA rework station that covers the full range of chip types and board sizes a professional repair workshop will encounter. Its three-zone heating system, four temperature sensors, 50,000-profile storage, and steel-mesh IR protection give it the process depth to handle daily high-volume rework without cutting corners on thermal management. As a manual BGA rework station, it offers experienced technicians direct, tactile process control backed by a level of temperature data that few machines at this price point provide.

 

For workshops that need a dependable, well-specified daily-use rework machine - without the cost and complexity of an optical alignment system - the DH-5880 is built for exactly that purpose.

 

 

For technical inquiries, OEM/ODM requirements, or after-sales support, contact Shenzhen Dinghua Technology Co., Ltd.