Bga Rework Stations Infrared

From complex motherboard rework to delicate IC replacement—achieve studio-grade results with unparalleled ease and accuracy.

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Description

Products Description

BGA Rework Station DH-A5 is a high-precision soldering machine automatic designed for repairing, reworking, and replacing Ball Grid Array (BGA) components on printed circuit boards (PCBs). Unlike basic rework stations, this advanced type integrates a CCD camera optical alignment system, which allows accurate positioning of the BGA chip with the solder pads before heating.

As a professional laptop repair machine and reliable mobile repairing machine, it uses real-time image capture and split-vision alignment, allowing operators to overlay component and PCB pad images to ensure perfect alignment and minimize placement errors. This feature is essential for repairing high-density PCBs in laptops, mobile phones, game consoles, servers, and other complex electronic devices.

product-766-422

Main Function

1.Remove (desolder) components from PCB

2.Place and align chips accurately

3.Reball and resolder components

4.Control and execute heating profiles

5.Monitor temperature in real time

6.Handle chips via vacuum pickup

7.Cool down PCB after rework

8.Store and recall repair data

9.Support rework of various SMD devices

Detailed Images

Large infrared preheating area: Ensures uniform heating across large PCBs, reducing thermal stress and preventing board deformation. (Mobile Repairing Machine)

Optical alignment: Provides clear visual positioning for accurate chip-to-pad alignment, minimizing placement errors. (Soldering Machine Automatic)