SMT Chip Rework Machine

 

 

Many rework stations keep the heaters fixed and ask the technician to slide the board until the chip sits underneath. That is fine for a phone board. It is much less fine for a large, populated PCB where the chip you need sits near a corner, or where the board is heavy enough that re-clamping it is a job in itself. The DH-A6 starts from the opposite assumption: the board stays where it is clamped, and the heaters go to the chip. The result is an automatic SMT chip rework machine that can reach any position on a motherboard without moving the board, then carries out desoldering, pick-up, mounting and soldering on its own.

 

 

 

 

 

 

 

 

 

1. Load the board and clamp it on the five-point support.

2. The laser point finds the centre of the chip, and the upper and lower heaters move into position together.

3.Pick a stored temperature profile on the touchscreen and start the cycle.

4.The machine desolders the chip and picks it up automatically. The removed chip goes to the recycling position.

5. Once the pads are cleaned, the replacement chip (new or re-balled) sits in the feeder.

6. The optical CCD aligns it, and mounting and soldering run automatically.

 

Between the first step and the last, the operator is watching the live curve rather than holding anything.

 

 

 

1. Preheating with carbon fibre IR

 

The preheating area uses carbon fibre heating and is the strongest of the three zones: 4,200W, against 1,200W each for the upper and lower heaters. Its job is to bring the whole board to a stable temperature first, so the local heaters only have to finish the work. The smaller the temperature difference across the board, the less warpage and the less stress on neighbouring components. Infrared also heats quickly and holds its temperature steadily, which suits long, repeated jobs.

 

2. Profiles and curve analysis

 

The DH-A6 has three independent heating areas, each under PID temperature control. The HD touchscreen shows the live curves while the cycle runs, and the same screen is used to set up and analyse profiles afterwards. More than 50,000 profile groups can be stored, so a board model that arrives every week becomes a select-and-start job. For a workshop or line that handles the same boards repeatedly, that is where an SMT chip rework machine saves the most time: the thinking is done once, and every later board runs the same proven profile.

 

3. Alignment, feeding and recycling

 

The optical CCD works together with the chip feeder. Feeding, recycling and aligning all run automatically, so the chip is checked against the pads optically before anything is soldered, rather than by eye. This matters most on leadless packages, where the contacts are hidden under the body of the chip. Used as a QFN rework station, the DH-A6 applies the same optical alignment and profile control it uses on ball-grid packages.

 

4. What it can rework

 

The DH-A6 handles chips from 1×1 mm up to 70×70 mm, with a minimum chip spacing of 0.15 mm. Package types include BGA, PBGA, FBGA, QFN, DFN, LGA and MLF, along with a few other components that need desoldering or soldering. In daily use that covers laptop and desktop mainboards, communication boards, industrial controllers and LED boards. For a shop whose work is mostly QFN and LGA, a QFN rework station that also handles BGA means one machine instead of two.

 

5. Where it sits in the Dinghua range

 

Dinghua's automatic line has three models that are often compared. The DH-A2E (5,300W) is the compact choice for routine laptop, console and phone boards. The DH-A5 is the choice when size is the limit: its chip range goes up to 100×100 mm and it takes very large boards. The DH-A6, at 6,800W, is for operations where the question is less how large the board is and more how many different positions on it have to be reached. If that describes your boards, a BGA rework station with moveable head is the logical fit, and an SMT chip rework machine with this much automation also keeps skill dependence low across shifts.

 

 

 

 

Item	Parameter
Power Supply	AC220V±10％ 50/60Hz
Rated Power	6800W
Top heater	1200W
Bottom heater	1200W
IR preheating area	4200W (Germany heating tube, heating area of 500*350mm)
Operation mode	Fully automatically disassemble,suction,mounting and soldering
Chip feeding system	Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage	50000 groups
Temperature control	K-type Sensor,Closed loop and 8~20 segments for temperature controlling program
Temperature accuracy	±1 ℃
Placement Accuracy	+/-0.01mm
Safety guard	pressure sensor +emergency knob,double-guard
PCB size	Max490*550 mm Min 10*10 mm
PCB thickness	0.2-15mm
BGA chip	1x1-65*65mm
Minimum chip spacing	0.15mm
External Temperature Sensor	5 pcs(optional)
Machine type	Desktop table (optional)
Dimensions	L970*W850*H950 mm

 

 

 

Dinghua has focused on BGA rework equipment for years, and its machines have been supplied to companies including Google, Foxconn, Micron, Vestel, Huawei, Kinpo and BYD. As a BGA rework station with moveable head, the DH-A6 rests on a simple idea: let the heaters do the travelling, and let the operator concentrate on the board. Whether it is used on large BGA chips or as a QFN rework station for leadless packages, the process stays the same. For the full datasheet, a sample test on your own board, or a custom fixture for your PCB, please get in touch.