Optical VGA Card BGA Rework Station

Optical VGA Card BGA Rework Station 

1.Application of Optical VGA Card BGA Rework Station

The motherboard of a computer, smartphone, laptop, MacBook logic board, digital camera, air conditioner, TV and other electronic equipment from the medical industry, communication industry, automobile industry, etc.

Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of Optical VGA Card BGA Rework Station

• Desoldering, mounting and soldering automatically.

• A precise optical alignment system

With 15inches and 1980P, even after small soldering dots can be observed totally, zoom in 10x~220x.

•Computer that is the brain of a machine, which is for PLC and PID controlled.

• The built-in vacuum in mounting head picks up BGA chip automatically after desoldering completed.

•IR heating area, carbon fiber heating tubes, dark light is easy to be absorbed by PCB, and IR heating area can be moved for the right position.

3.Specification of Optical VGA Card BGA Rework Station

4.Details of Optical VGA Card BGA Rework Station

1.A CCD camera( precise optical alignment system) ; 

2.HD digital display ; 

3. Micrometer (adjust an angle of a chip) ; 

4.3 independent heaters ( hot air & infrared ) ;

 5. Laser positioning ; 

6. HD touch screen interface, PLC control ; 

7. Led Headlamp.

5. Why Choose Our Optical VGA Card BGA Rework Station? 

6.Certificate of Optical VGA Card BGA Rework Station

7.Packing & Shipment of Optical VGA Card BGA Rework Station

8.The FAQ of Optical VGA Card BGA Rework Station

How to measure the signal under the BGA package?

To measure the signal below the BGA, there are roughly two scenarios: Scenario A: Measurement of the waveform at low-speed IO operation of the chip; Scenario B: Measurement of signal quality at high-speed IO. Scenario A scenario: Measure low-speed IO. You can leave the test point in the schematic phase and place it in a good measurement position. If you don't have a test point, you can only fly. There are two cases here: First, if the pin to be tested is close to the edge of the chip, you can fly directly from the pad. Flying line method: 1, first take the chip off, observe the situation of the ball, if there is no continuous tin and shape is better, this chip can be put back in place. Of course, if you do not pick it, you can only throw it away and change it. 2. The enameled wire is burned off with a very small tip, and the soldering iron is used on the PCB pad. Flatten the line to make sure it is not tight, otherwise, it will bounce off when the air gun blows. 3, chip back in place. Air gun blowing. Refer to my other answer "hand solder BGA". Second, if the pin to be tested is far from the edge, such as the third row, the success rate is quite low. It is recommended that you remove the chip and fly all the pins onto the pad. Which test to measure. Scenario B scheme: For high-speed IO, such as USB, MIPI, DDR, etc., leaving test points and flying lines is not desirable, so that only the signal can be measured, and the signal quality cannot be accurately measured. Moreover, the test point itself occupies a valuable wiring area and brings about a bad influence on the termination impedance. The chip can only be removed and the S-parameters are measured directly on the pad under test.