Laptop Chipset Repair Machine
The DH-G760 is a high-precision, fully automatic optical rework station designed for professional BGA, SMD, and LED bead rework.
Description
Product Overview
Fully Automatic BGA Chip Reballing Machine for BGA, LED & SMD
The DH-G760 Mobile phone ic repairing machine integrates automatic operation, HD optical alignment and laser-assisted technology to achieve fast, accurate and repeatable PCB rework.
- 2MP Optical System: Enables ultra-precise component alignment
- Automated Feeding: Delivers steady and high-efficiency operation
- Advanced Temperature Control: Guarantees consistent, reproducible results
Tailored for rigorous rework of PCBs, motherboards and LED components, the DH-G760 automatic mobile repairing machines achieves high-precision performance while greatly reducing manual workload.
Applications
This versatile Mobile phone ic repairing machine is not limited to LEDs. Its precise infrared heating and stable platform make it equally effective for:
Repairing LEDs on display modules (TV, monitor, commercial signage) and backlight units.
General SMD rework and prototyping.
Handling BGA and other complex package types, making it a true multi-role automatic bga chip reballing machine for your lab or production floor.
Products Details
Versatile Rework for All PCB Applications
The DH-G760 is built to perform precise, damage-free desoldering, alignment, placement and soldering for BGAs, CSPs, QFPs and other delicate SMD components.
- Extensive Component Compatibility: Supports BGAs, CSPs, fine-pitch QFPs and more
- Full PCB Compatibility: Works with single-layer to high-density multilayer boards
- Wide Size Coverage: 10 × 10 mm up to 680 × 550 mm
- Damage-Free Operation: Effectively protects surrounding components
Thanks to its great versatility, the RW1500 is perfectly suited for rework on both microelectronic parts and large-size PCBs.
High-Definition Split-Vision Alignment
Equipped with a high-definition split-vision system, the DH-G760 automatic mobile repairing machines enables fast and accurate alignment between components and PCB pads.
- 2MP CCD Camera: Delivers sharp, high-resolution images
- Max. 230X Magnification: Ensures precise positioning for fine-pitch components
- Superimposed Imaging: Visual alignment of component leads and PCB pads
- 15" HD Monitor: Presents clear and detailed views
Combined with joystick operation and micrometer fine-tuning, it achieves accurate alignment along X, Y and rotational axes for stable, repeatable performance.
Advanced Monitoring & Process Control
The DH-G760 automatic bga chip reballing machine is equipped with comprehensive functions for real-time monitoring, parameter adjustment and process optimization.
- Side-view Camera: Enables real-time observation of reflow soldering
- Adjustable Lighting: Ensures clear visibility during operation
- Nitrogen Supply: Facilitates high-reliability soldering
- 4 Thermocouple Ports: Delivers accurate real-time temperature tracking
These functions allow full oversight and precise control throughout the entire rework process, delivering stable and superior results.
Four external temperature sensor ports enable real-time monitoring, delivering more accurate and stable temperature control.
Intelligent micro airflow control automatically regulates wind volume according to component dimensions, ensuring efficient rework while firmly securing tiny LEDs during soldering.
Infrared‑Laser Combined Alignment System: This integrated solution adopts laser positioning with real‑time closed‑loop feedback, delivering up to 99.9% placement accuracy.
Equipped with a smooth, high-temperature resistant glass shield, this machine not only looks clean and professional but also effectively prevents small components from falling inside, combining strong protection with a modern industrial design.
Offering both manual control for process development and fully automatic operation for batch production, this exceptional versatility **streamlines** workflows across prototyping and high-volume repair applications.
