Laptop
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Laptop

Laptop Repair Machine

Our BGA Rework Station is a state-of-the-art smd soldering station engineered for accuracy, repeatability, and ease of use. It combines optical vision, multi-zone heating, and automated handling to meet the demanding needs of PCB repair, especially in mobile phone repair and compact electronics restoration.

Description

Product Overview

 

Professional BGA Rework Station – Ultimate Solution for Precision Mobile Phone Repair

This advanced BGA rework station integrates optical alignment, automatic dismantling/welding, and intelligent temperature control to deliver industry-leading precision and efficiency. Designed for modern electronics repair, it significantly simplifies the rework of BGA chips-from the smallest SMD components to large processors-making it an indispensable mobile phone repair tool for any professional workshop.

Equipped with a high-definition CCD vision system, laser positioning, and ±0.01mm placement accuracy, it completely eliminates misalignment. The triple-zone heating (top hot air + bottom infrared) with closed-loop K-type thermocouple control ensures temperature accuracy within ±2°C. With touchscreen operation, pre-loaded programs, and both manual/auto modes, even complex chip replacements become quick and repeatable.

Whether you're repairing smartphones, tablets, or other PCBAs, this station offers versatile compatibility (PCB up to 550×530mm, chips from 2x2mm to 80x80mm) and includes practical features such as fine wire mesh protection, external temperature ports, USB data export, and CE-certified safety protection.

Ideal for mobile phone repair specialists and electronics manufacturers, it boosts productivity, reduces human error, and ensures reliable, professional results every time.

 

Key Features  

 

1.Optical Alignment System
High-definition adjustable CCD camera with 10x–100x magnification, dual-color splitting, auto-focus, and brightness adjustment. Allows full-view observation to prevent "dead angles" and ensures perfect chip placement.

2.Fully Automated Operation
Automatically dismantles, solders, and recollects chips. PLC-controlled with step motor drive and linear slide rail for precise X/Y/Z movement. Frees technicians from manual repetition.

3.Adjustable Airflow
Gentle air flow can be adjusted according to component size, preventing small parts from being blown away during rework.

4.Laser Positioning & V-Groove PCB Holder
Laser quickly indicates board location; universal V-groove fixture holds PCBs from 10×10mm up to 550×530mm, with ±15mm fine-tuning in X/Y directions.

5.Triple Heating Zones with Independent Control
Top heater: 1200W hot air.
Bottom heaters: Zone 2 – 1200W, Zone 3 – 4200W infrared.
Each zone independently controlled via PID auto-tuning and K-type thermocouple closed-loop system.

6.Safety & Protection
Fine steel mesh on preheater prevents small parts from falling in; emergency stop and auto power-off protection; CE certified.

7.User-Friendly Touchscreen Interface
Built-in industrial PC running Windows, supports multi-curve real-time display, program storage, curve analysis, and password protection. No specialized training needed.

8.Dual Operation Modes
Both manual and automatic modes for flexible debugging or batch processing.

9.External Temperature Ports & USB Export
1–5 optional external sensor ports for accurate profile verification; USB interface for software updates and data transfer to PC.

 

Products Parameters 

Model Automatic Optical Alignment BGA Rework Station
Total Power 6800W
Power Supply AC220V±10%, 50/60Hz
PCB Size Max 550×530 mm, Min 10×10 mm
Chip Compatibility 2x2mm ~ 80x80mm BGA/CSP/QFN
Placement Accuracy ±0.01mm
Temperature Control Accuracy ±2°C
Minimum Chip Pitch 0.15 mm
Camera Magnification 10x - 100x
Control System Embedded Industrial PC + HD Touchscreen
Heating Method Top Hot Air + Lower Infrared + Bottom Preheating
Dimensions (LxWxH) 1022mm × 670mm × 850mm
Net Weight Approx. 97kg

 

Advanced Design Details

Integrated heating and placement head with lead screw transmission.

8-segment heating/cooling + 8-segment soaking control.

Built-in vacuum pump with 60° rotatable suction nozzle (no external air supply required).

Sound alert 5–10 seconds before cycle completion; optional cooling fan to prevent PCB warping.

Alloy nozzles available in multiple sizes, 360° rotatable and easy to replace.

External temperature ports allow real-time profiling and calibration.

Why Choose Our Rework Station?

This machine is not just a smd soldering station-it's a complete precision rework solution. It increases first-pass success rates, reduces board damage, and speeds up repair workflows, making it the ideal mobile phone repair tool for service centers, manufacturers, and R&D labs. With robust construction, precise controls, and automated functions, it turns complex BGA rework into a simple, repeatable process.

Products Details

  • bga rework station
    High-definition optical alignment ensures precise component placement.
  • 222
    Bottom air vents, high-quality heating elements, and precise temperature control.
  • rework
    Micrometer adjustment for BGA placement, achieving a placement accuracy of ±0.01mm.
  • bga repair station
    Large PCB trays, available in various sizes.

 

Certifications

 

product-755-545

 

Our company

product-1013-375

About Shenzhen Dinghua Technology Co., Ltd.

Established in 2011, Shenzhen Dinghua Technology specializes in providing high-precision equipment and intelligent solutions for the electronics manufacturing and repair industries. Confronted with the ever-increasing density of components and shrinking tolerances, we are committed to turning complex precision processes into reliable and efficient standardized operations through technological innovation.

Core Products & Value:
Our main offerings include high-end X-ray inspection systems and automated BGA rework stations. These solutions address critical pain points, from non-destructive testing of internal solder defects to the precise rework of high-density chips, helping our customers enhance quality and yield rates.

Our Distinct Advantages:

Practice-Driven R&D: Deeply embedded in the SMT and NDT fields, our development is closely aligned with real-world production and repair scenarios.

Intelligent, Integrated Systems: We deliver more than precision hardware. By synergizing control systems and software, we build smart workflows that improve process decisions and traceability.

Commitment to Long-Term Success: We view our clients as partners, providing comprehensive technical support and application services to ensure sustained operational stability and lasting investment value.

Grounded in innovation and integrity, Dinghua Technology strives to advance global standards in electronics manufacturing and repair alongside our customers.

 

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