BGA Chip Desoldering And Soldering Machine
Full IR BGA rework station, two heating zones, chip size available: 2*2~80*80mm, PCB size available: 300*360MM
Description
BGA chip desoldering and soldering machine
The BGA rework station DH-6500 is the longest historical rework machine, being widely used for XBOX, PS3, PS4 and computer repaired etc.
There are V-groove, alligator clip and universal fixtures for a different chip fixed on that worktable, for soldering or desoldering.
Upper head can be adjusted to higher or lower, even though to left or right, which is very convenient for a component to be soldering or desoldering.
IR preheating zone, applicated for a PCB with 300*360mm, such as TV, gaming console machine and other communication equipment.
2. The details of BGA chip desoldering and soldering machine
Specification of DH-6500 | |
Total Power | 2300W |
Top heater | 450W |
Bottom heater | 1800W |
Power | AC110~ 220V±10％ 50/60Hz |
Top head movement | Up / down, rotate freely. |
Lighting | Taiwan led working light, any angle adjusted. 5W |
Storage | Store 10 groups of a temperature profile |
Positioning | V-groove, PCB support can be adjusted in X, Y direction with an external universal fixture |
Temperature control | K-TYPE, Closed-loop |
Temp accuracy | ±2℃ |
PCB size | Max 300*360mm Min20mmⅹ20mm |
| Weight | 16kg |
3. BGA chip desoldering and soldering machine
4. Product features of BGA chip desoldering and soldering machine
DH-6500 is a universal semi-automatic infrared repair complex with PC synchronization and a ceramic emitter for repairing CBGA, CCGA, CSP, QFN, MLF, PGA and all epoxy μBGA components. Installation of various temperature profiles makes it possible to select the required soldering mode when using different solders, including lead-free.
FEATURES
Repair complex for motherboards of laptops, PCs, server boards, industrial computers, all types of game consoles, boards of communication equipment, television equipment with LCD and other works with BGA large boards.
Ideal for soldering and repairing CBGA, CCGA, CSP, QFN, MLF, PGA and all types of epoxy μBGA.
It is used for both lead and lead-free soldering.
Uses advanced dark infrared soldering technology.
Uses an advanced K-type thermocouple for more accurate temperature detection.
The technology of temperature control with feedback provides accurate temperature control and uniform thermal distribution.
The dismantling process takes only about 5 minutes.
The maximum temperature reaches 400 ° C.
The ability to connect to a PC or laptop via USB interface and control using the software "IRSOFT".
Ability to set 8 positions of temperature rise and 8 positions of temperature retention.
The ability to store 10 groups of temperature profiles at the same time.
The set comes with a CD with a manual and a demo video.
5. product details of the keyboard rework station
 | Cooling fan After completing the heating, manually turn on the high-power fan to cool the PCB board to avoid PCB board deformation. |
Temperature zone The preheated temperature zone uses the Taiwan ceramic heating plate to make the plate PCB even warm up. Avoid weakening of the PCB board due to uneven heating. Add violent glass on the board to avoid small chips from falling and burning. |  |
 | Limited bar Effectively control the distance between the upper head and the BGA and prevent the touch of the board. |
6. Dinghua Technology, factory and workshop and patents
7. Delivery, shipping and services of keyboard rework station
Small BGA rework station packed in a carton as below
For small quantity, less than 20 set, we amy suggest you ship them by an express
