BGA Reballing Kit PS3 XBOX
Small machine's size, big preheating zone, double-IR, flexible top head.
Description
BGA reballing kit PS3 XBOX
DH-6500 IR Rework station for laptop motherboards, motherboards, desktops, servers, industrial computer motherboards, all types of gaming cards, motherboards, communication equipment, LCD TVs and other large motherboards
Innovative design, effective solutions for infrared recovery stations are usually vulnerable to the effects of air flow. Precise temperature control can easily handle lead-free soldering.
With a V-groove, crocodile clips and universal mounting hardware for various chips mounted on the soldering or desoldering table
The upper part can be adjusted to be higher or lower, either left or right, which is very convenient for soldering or soldering components.
Infrared heating zone, heating area: 240 * 200 mm, used with PCB 300 * 360 mm, such as TVs, game consoles and other communication devices
2. The details of BGA reballing kit PS3 XBOX
Specification of BGA reballing kit PS3 XBOX | |
Total Power | 2300W |
Top heater | 450W |
Bottom heater | 1800W |
Power | AC110~ 220V±10％ 50/60Hz |
Top head movement | Up / down, rotate freely. |
Lighting | Taiwan led working light, any angle adjusted. 5W |
Storage | Store 10 groups of a temperature profile |
Positioning | V-groove, PCB support can be adjusted in X, Y direction with an external universal fixture |
Temperature control | K-TYPE, Closed-loop |
Temp accuracy | ±2℃ |
PCB size | Max 300*360mm Min20mmⅹ20mm |
| Weight | 16kg |
3. BGA chip desoldering and soldering machine
4. Product Features BGA Chip Soldering Machine
The DH-6500 is a universal semi-automatic infrared repair center with PC synchronization and ceramic discharge for repairing CBGA, CCGA, CSP, QFN, MLF, PGA and all epoxy µBGA components. Installation of various temperature profiles allows you to select the desired soldering mode when using another soldering iron, including without lead.
Feature
Repair complexes for motherboards of laptops, PCs, server boards, industrial computers, game consoles of all types, communication boards, television devices with LCD displays and other tasks with large BGA boards.
Suitable for soldering and repairing CBGA, CCGA, CSP, QFN, MLF, PGA and all types of epoxy µBGA
Used for lead-free and lead soldering
Using advanced infrared soldering technology
Use thermocouples type K for more accurate temperature determination.
Temperature control technology with recommendations for precise temperature control and uniform heat dissipation
The demolition process takes only about 5 minutes.
Maximum temperature up to 350 ° C
The ability to connect to a PC or laptop via USB interface and control using the software "IRSOFT"
The ability to set the temperature to 8 positions and maintain the temperature on 8 positions
Ability to store 10 temperature profiles at the same time
Includes a CD with a guide and video demonstration.
5. product details of the keyboard rework station
 | Cooling fan After completing the heating, manually turn on the high-power fan to cool the PCB board to avoid PCB board deformation. |
Temperature zone The preheated temperature zone uses the Taiwan ceramic heating plate to make the plate PCB even warm up. Avoid weakening of the PCB board due to uneven heating. Add violent glass on the board to avoid small chips from falling and burning. |  |
 | Limited bar Effectively control the distance between the upper head and the BGA and prevent the touch of the board. |
6. Dinghua Technology, factory and workshop and patents
7. Delivery, shipping and services of keyboard rework station
Small BGA rework station packed in a carton as below
For small quantity, less than 20 set, we amy suggest you ship them by an express
