Infrared VS Hot Air Rework Chipset

                                                  Automatic Optical Infrared VS Hot Air Rework Chipset

Automatic: Refers to a process or system that is self-operating or done by a machine without human intervention.

Hot Air Rework: Refers to the process of heating and removing or replacing electronic parts on a circuit board using hot air.

 

1. Application of Automatic Optical Infrared vs. Hot Air Rework Chipset

This solution is compatible with all types of motherboards or PCBA (Printed Circuit Board Assemblies). It supports soldering, reballed, and desoldering a wide variety of chip types, including:

• BGA (Ball Grid Array)
• PGA (Pin Grid Array)
• POP (Package-on-Package)
• BQFP (Bent Quad Flat Package)
• QFN (Quad Flat No-lead)
• SOT223 (Small Outline Transistor)
• PLCC (Plastic Leaded Chip Carrier)
• TQFP (Thin Quad Flat Package)
• TDFN (Thin Dual Flat No-lead)
• TSOP (Thin Small Outline Package)
• PBGA (Plastic Ball Grid Array)
• CPGA (Ceramic Pin Grid Array)
• LED Chips

2. Product Features of Automatic Optical Infrared vs. Hot Air Rework Chipset

Chipset: A group of integrated circuits that work together to perform specific functions in a computer system. It typically includes the central processing unit (CPU), memory controller, input/output interfaces, and other essential components.

 

3. Specification of Automatic Optical Infrared VS Hot Air Rework Chipset

 

Power	5300w
Top heater	Hot air 1200w
Bottom heater	Hot air 1200W. Infrared 2700w
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	Ktype thermocouple,closed loop control,independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm, Min 22 *22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGA chip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

 

4. Details of Automatic Optical Infrared VS Hot Air Rework Chipset

 

5.Why Choose Our Automatic Infrared VS Hot Air Rework Chipset? 

 

6. Certificate of Automatic Infrared VS Hot Air Rework Chipset

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, 

C-TPAT on-site audit certifications.

 

7.Packing & Shipment of Automatic Infrared VS Hot Air Rework Chipset

 

 

8. Shipment for Automatic Infrared VS Hot Air Rework Chipset

DHL/TNT/FEDEX. If you want another shipping term, please tell us. We will support you.

 

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

 

 

11. Related Knowledge

About SMT Rework

With the rapid development of electronic manufacturing technology, there is an increasing demand from customers for PCB rework, and new solutions and technologies are needed to address these emerging requirements.

Many customers require effective rework of BTC (Bottom Terminated Components) and SMT PCBs. Over the next few years, the following topics will become more widely discussed:

• BTC Devices and Their Characteristics: Handling issues such as bubble problems
• Smaller Devices: Miniaturization, including the rework capability for 01005 components
• Large-Size PCB Processing: Dynamic warming techniques for large board rework
• Reproducibility of the Rework Process: Flux and solder paste application (e.g., dip technology), removal of residual solder (automatic tin removal), material supply, handling multiple devices, and traceability of the rework process
• Operational Support: Increased automation, software-guided operation (user-friendly human-machine interface)
• Cost-Effectiveness: Rework systems that meet different budget requirements, and ROI (Return on Investment) assessments

The topics mentioned above have not yet been fully implemented in practice. While there has been much discussion in the industry about the rework capability for 01005 components, no technology claiming this ability has been proven to provide consistent success in actual rework situations. In sophisticated production lines, many parameters must be observed and controlled, including:

• Ensuring that soldering and device removal do not affect nearby components
• Adding new solder paste to small solder joints
• Properly picking up, calibrating, and placing devices
• PCB coating
• PCB cleaning, etc.

However, with the advent of the 01005 device, rework challenges have inevitably arisen. On the one hand, the device size is getting smaller, and the assembly density is increasing. On the other hand, the size of the PCB is becoming larger. Thanks to advancements in communication products and network data transmission technologies (e.g., cloud computing, Internet of Things), the computing power of data centers has grown rapidly. At the same time, the size of motherboards for computing systems has also increased. This creates the challenge of uniformly and completely preheating large multilayer PCBs (e.g., 24" x 48" / 610 x 1220mm) during the rework process.

Additionally, in the growing field of electronics manufacturing, rework processes have become an integral part of electronic assembly, and the tracking and recording of individual circuit boards has become a critical requirement. Among the topics mentioned, the blueprint for rework capabilities by 2021 is described, with three key points to be introduced below. Other issues are also crucial for future rework processes and can often be addressed through practical certification, requiring only updates or improvements to existing rework equipment.