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Hot Air Rework Station

This professional-grade rework station is a comprehensive solution for precision soldering and desoldering of advanced chip components. By integrating infrared bottom preheating, triple-zone heating, and full automation, it delivers exceptional accuracy, repeatability, and ease of operation. It is the ideal tool for electronics manufacturing, repair, and R&D, capable of handling the most delicate 0.15mm-pitch chips to large 80mm BGAs with absolute reliability. We stand among premier rework station manufacturers by offering this robust desoldering station engineered for performance.

Description

Product Overview

 

Precision Rework Redefined: The Advanced Infrared BGA Rework Station

 

Master the most challenging SMD and BGA rework with our state-of-the-art station, engineered for unmatched accuracy and ease of use. This machine transforms complex chip replacement into a simple, automated process.

 

Featuring infrared preheating for fast, stable, and uniform heating, it ensures perfect soldering results for components from 2x2mm to 80x80mm. With fully automated optical alignment (±0.01mm), laser positioning, and intelligent servo control for desoldering and placement, it eliminates human error. The intuitive touchscreen, pre-loaded programs, and smart features like post-repair scanning make professional-grade rework accessible to any technician.

 

Designed for versatility, it handles a wide range of packages (SOP, QFP, BGA, QFN, etc.) and PCB sizes up to 550x600mm. As leading rework station manufacturers, we deliver reliability and precision. This all-in-one desoldering station is your key to achieving flawless repairs with maximum efficiency and yield.

 

Key Features 

 

1.Ultimate Precision & Automation: High-definition optical alignment system with 10x-100x magnification and laser pointer ensures chip placement accuracy within ±0.01mm. The fully automated process for desoldering, collection, and placement minimizes operator skill dependency and eliminates errors.

 

2.Advanced Infrared Heating System: Features a fast, stable, and energy-efficient infrared preheating zone. Combined with independent top and bottom hot air zones, it creates a perfectly controlled thermal profile for safe, reliable soldering of any component, from the smallest chip to large processors.

 

3.Intelligent Process Control: User-friendly industrial touchscreen PC with PLC control allows easy setup of multi-segment temperature curves. Five external K-type thermocouple ports enable real-time profile verification and closed-loop control, maintaining temperature accuracy within ±1°C.

 

4.Enhanced Versatility & Protection: The universal V-slot fixture and movable heating modules accommodate PCBs from 10x10mm to 550x600mm. A protective universal clamp safeguards board edges and components, while multiple titanium alloy nozzles suit various chip sizes.

 

5.Professional Workflow Integration: Equipped with USB for data export/analysis and automatic post-rework scanning for quality assurance. The tool-free, 360° rotatable nozzle design and servo-driven Z-axis enhance operational convenience and efficiency.

 

Products Parameters 

Category Specification
Power Total: 7000W,
Top Heater 1200W
Bottom Zone 2 1200W + Zone 3 3600W
Power Supply AC220V ±10%, 50/60Hz
Temperature Control K-Type Thermocouple, Closed-Loop
Control System Industrial Touch PC, Multi-segment Profile
Accuracy ±1°C
PCB Size Max: 550 x 600 mm, Min: 10 x 10 mm
Component Range Chip Size: 2x2 mm to 80x80 mm
Placement Accuracy ±0.01 mm
Min. Pitch 0.15mm
Vision System CCD Camera, 10x-100x Magnification, Laser Pointer
Fixture V-Groove with Universal Clamp, XY Fine Adjustment (±15mm)
External Thermocouples 5 Ports (Standard)
Dimensions (LxWxH) 650 x 700 x 850 mm
Net Weight 92 kg

Products Description

 

  • Smart Control Center: Features a password-protected, high-resolution touchscreen HMI running on an industrial PC. It enables real-time display and analysis of temperature curves, multi-mode operation settings, and foolproof safety functions, all controlled by a precise PLC system.
  • Precision Thermal Management: Utilizes a high-accuracy K-type thermocouple closed-loop and auto-compensation system, synchronized with the PLC, to achieve precise temperature control within ±1°C. External sensor ports allow for meticulous profile verification and calibration.
  • Automated Servo Motion System: Incorporates a servo-driven control system for automated desoldering, placement, and soldering modes. The linear sliding base allows for fine micro-adjustment or rapid positioning in X, Y, and Z axes, ensuring stability and repeatability.
  • Versatile Board Handling: The movable universal clamp protects PCB edges from damage and prevents board warping, accommodating various BGA package sizes and board layouts securely.
  • Flexible Heating Architecture: Both the top and bottom heaters can move synchronously for quick PCB alignment. The bottom hot air heater features electric lift to clear bottom-side components, while the laser pointer enables fast setup changeovers without complex parameter adjustments.
  • Professional Tooling: Comes with multiple easily interchangeable titanium alloy nozzles that can be rotated and fixed at any 360° angle for optimal airflow direction.
  • Three-Zone Independent Heating: Three independently controlled heating zones (top hot air, bottom IR, bottom hot air) can operate simultaneously with multi-segment profiles. The infrared heater uses imported high-performance tubes with a high-temperature micro-crystal panel for even PCB preheating, guaranteeing perfect soldering conditions.

 

Products Details

  • 2
    Optical alignment ensures precise chip placement.
  • 1
    The preheating zone uses infrared heating tubes, which provide rapid heating and stable temperature control.
  • 5
    Laser positioning, the motherboard is placed precisely.
     
  • Repair tools 5
    Optical alignment, automatic focusing
  • 17689658124340
    Gentle breeze adjustment function: the fan speed is adjusted according to the chip size.
     
  • 2
    LED shadowless lighting allows for clear observation of the entire repair process.
  • product-1000-702
    The control panel features a pull-out drawer design.
  • 17700144072479
    Micrometer-based alignment adjustment, achieving a placement accuracy of ±0.01mm.

 

Certifications

 

photobank 4

 

photobank 3

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H6bad05e7c66b406c840223ae91fdf11aW

Hbee29a59bbb642aba003d0c7a11eeae6q

photobank 1

photobank 2

photobank-

 

 

 

why choose us
 

After years of development and focused efforts, the company possesses 78 patents and intellectual property rights, 97 quality control processes, and its products cover three major series: low, medium, and high-end. It has completed the research and development and production of products ranging from manual and semi-automatic to fully automatic. Since its establishment in 2011, the company has continuously expanded its scale and now has two major subsidiaries: "Shenzhen Dinghua Kechuang Automation Co., Ltd." and "Shenzhen Dinghua Kechuang Technology Co., Ltd."

company

why choose our products

 

With research and development as our foundation, we have a professional R&D team that continuously updates our technology to meet the demands of market development. We'll help you solve any problems you may have.

 

With quality as the core, imported core components ensure durability and reliable quality.

 

After-sales service is guaranteed, and technical support is available during the warranty period.

 

Contact now

 

 

 
 
 
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