SMT BGA Rework Station With Temperature Control

 

 

The DH-5880 is a high-performance, non-optical manual BGA rework station and an SMT BGA rework station with temperature control engineered for technicians who demand precision, reliability, and total control over the soldering process. Designed to handle everything from small chips to large PCBs, it is the ideal solution for repair shops, R&D labs, and small-batch production lines.

 

Three-Zone Independent Heating

The IC rework station DH-5880 consists of a three-zone thermal heating system that provides uniform heat distribution and prevents warping of the PCB.

 

Top Heater: Hot air heating for precise component-level reflow.

Bottom Heater: Hot air heating to ensure the board is heated evenly from below.

IR Preheating Plate: A large infrared area that maintains consistent board temperature, minimizing thermal stress on sensitive components.

 

Advanced Thermal Monitoring & Control

Precision is nothing without data. The IC rework station DH-5880 includes four independent temperature sensors, enabling operators to view actual temperature readings at multiple locations on the PCB at once and ensure the thermal profile matches the specifications provided by the manufacturer. The HD Touch Screen Interface controls all aspects of operation using an easy-to-use interface. The software offers several capabilities to manage operations, including:

- Storing and selecting from multiple temperature profiles.

- Monitoring real-time temperature curves and performing analytical evaluations.

- Changing operational settings quickly through an immediate action on the touch panel.

 

Technical Excellence for Every Workbench

Whether you are repairing motherboards, laptops, or industrial control boards, the manual BGA rework station DH-5880 provides the thermal stability and user-friendly interface needed to achieve high success rates in BGA rework. Its robust build and high-definition controls bridge the gap between entry-level tools and high-end industrial machinery.

 

Integrated Vacuum Pen

A built-in suction tool for the safe and effortless pick-up of hot components post-desoldering.

 

 

 

 

 

Item	Parameter
Total Power	5500w
Top heater	1200w
Bottom heater	1200w ( the second temperature zone)
Infared heater	3000w ( the third temperature zone)
Operation mode	Touch screen+manual
Dimensions	L500*W600*H700mm
Temperature profiles storage	50000 groups
PCB positioning	V-groove + universal fixture + 5-points support + Adjustable in X direction
BGA positioning	Laser pointing at its center
Temperature control	K-type Thermocouple + Closed Loop + Auto compensation
Temperature accuracy	±2℃
PCB size	Max 450*380mm Min 10*10mm
BGA size	1*1-80*80mm
BGA absorption mode	Vacuum suction pen
Minimum chip spacing	0.1mm
External temperature sensor	4, optional
Machine type	desktop
Net weight	48kg

 

 

 

 

 

 

  

1. What is soldering and desoldering?

 

Soldering (Reflow): This is the process of attaching a BGA chip to the PCB. Because the connections (solder balls) are underneath the chip, you cannot use a standard soldering iron. Instead, the rework station applies a precise "heat profile" that melts all the solder balls simultaneously. As they melt, surface tension helps the chip self-align to the pads on the board, creating a permanent electrical bond once cooled.

 

Desoldering (Removal): This is the process of removing a faulty or damaged chip. The rework station heats the chip and the board until the solder balls reach their liquid state. Once molten, the vacuum suction pen is used to lift the chip safely off the board without tearing the delicate copper pads or damaging neighboring components.

  

2. What can a BGA rework station do?

 

A manual rework station like the DH-5880 is a multi-functional tool designed for the entire lifecycle of a chip repair:

 

Component Removal: Safely desolders CPU, GPU, or memory chips from motherboards (laptops, game consoles, smartphones).

Precision Soldering: Re-installs new or refurbished chips using customized temperature profiles to ensure a perfect "factory-quality" bond.

Thermal Stress Prevention: Using its bottom IR preheater, it warms the entire board to prevent the PCB from warping or "popcorning" (internal heat damage) during the repair.

Real-Time Monitoring: With four temperature sensors, it tracks the exact heat at the chip and the board surface, ensuring you don't overheat.

 

3. Why choose DH-5880?

 

The DH-5880 (SMT BGA rework station with temperature control) balances cost-efficiency with professional-grade thermal management. Its non-optical design offers a tactile, straightforward workflow for experienced operators, while the sophisticated sensors ensure your thermal profiles stay within strict safety limits.