Infrared bga rework station
1. High success rate of repairing chips.
2. Simple and easy operation
3. Infrared heating. No damage to PCB and chip.
Description
Keyboard Camera BGA Rework Machine
1.Application of Keyboard Camera BGA Rework Machine
Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.
Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Keyboard Camera BGA Rework Machine
(1) Precise temperature control.
(2) High success rate of repairing chips.
(3)Two infrared heating areas increase temperature gradually.
(4)No damage to chip and PCB.
(5)CE certification guaranteed.
(6) Sound hint system: there is voice reminder 5s-10s before the completion of heating,to get the operator prepared.
(7) V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
(8) V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
3.Specification of Keyboard Camera BGA Rework Machine
4.Details of Keyboard Camera BGA Rework Machine
1. Two infrared heating zones ;
2.Led headlamp;
3. Dash board operating;
4. Limit bar.
5. Certificate of Keyboard Camera BGA Rework Machine
6.Packing & Shipment of Keyboard Camera BGA Rework Machine
7. Related knowledge
The BGA packaging process
In the 1990s, with the advancement of integration technology, improvement of equipment, and the use of deep submicron technology. Ultra Deep Submicron Integrated Circuit Reliability have emerged one after another, silicon single chip integration As the degree of continuous improvement, the requirements for integrated circuit packaging have become more stringent,
the number of I/O pins has increased dramatically, and the power consumption has also increased. In order to meet the needs of development, a new type of ball grid array package, abbreviated as BGA (Ball Grid Array Package), has been added to the original
Package types.
(1) Features of BGA Package
Once BGA appeared, it became the best choice for high-density, high-performance, multi-functional, and high-I/O pin packages for VLSI chips such as CPUs and North and South
Bridges. Its features are:
(1)Although the number of I/O pins increases, the pin pitch is much larger than QFP, which improves the assembly yield;
(2)Although its power consumption increases, BGA can be controlled by a controlled collapse chip method, abbreviated as C4 welding, which can improve its electrothermal performance.
(3)Suitable for industrialized production. Controlled Collapse Chip Connection C4 Technology.
