Chip Reballing Machine
The Dinghua semi-automatic batch ball placement machine is suitable for ball placement on various types of chips. It allows for quick switching between different fixtures and stencils in the workshop.
Description
Products Description
Products Parameters
| Total Power | 300W |
| Power Supply | AC220V±10% 50Hz |
| Overall Dimensions | L650×W400×H350 mm |
| Positioning Method | Fixture Board Slot |
| Lifting Method | Stepper Motor |
| Control Precision | ±0.01mm |
| Machine Weight | 49kg |
| Application | BGA ball mounter, BGA reballing station, BGA reballing machine |
Products Details
Touch screen human-machine interface, easy to operate and quick to learn.
Infrared sensing technology ensures that the device only starts working when everything is ready, making it safe and efficient.
The chip fixture allows for placing multiple chips at once, resulting in significantly increased efficiency.
The stencil is customized according to the chip specifications, allowing it to be compatible with various chip ball grid arrays.
Easily and efficiently secure the chip, ensuring it does not shift during ball grid array (BGA) soldering and vibration.
The ball placement was excellent, with no missing balls and no misalignment.
The sliding rails operate smoothly, ensuring precise positioning.
Thickened steel base plate, sturdy and stable.
The cylinder automatically rises and lowers, and the balls are automatically inserted.
The mesh panel is secured with clips, allowing for quick replacement.
