BGA IC Chip Repair Machine

BGA IC Chip Repair Machine

Dinghua DH-A2 automated BGA IC Chip Repair Machine with high successful rate of repairing. Lifetime technical support can be offered.

Description

                                                             

 BGA Chip Rework

BGA Chip Rework

Model: DH-A2

1.Application Of Automatic

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

 

2.Advantage of Hot Air Automatic BGA IC Chip Repair Machine

BGA Chip Rework

 

3.Technical data of laser positioning automatic

BGA Chip Rework

 

4.Structures of Infrared CCD Camera

 

ic desoldering machine

chip desoldering machine

pcb desoldering machine

 

5.Why Hot air reflow BGA IC Chip Repair Machine is your best choice?

motherboard desoldering machinemobile phone desoldering machine

 

6.Certificate of Optical Alignment Automatic

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

 

7.Packing & Shipment of CCD Camera

Packing Lisk-brochure

 

 

8.Shipment for Split Vision Automatic

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

 

 

9. Related Knowledge of Automatic Infrared BGA IC Chip Repair Machine

Nowadays, automatic solder paste printing presses are increasingly used in industrial production. However, when the automatic solder paste printing machine is used for extended periods, the equipment will inevitably face issues like aging and rust. Therefore, special attention must be given to maintaining the automatic solder paste printing equipment. Here, we introduce the proper maintenance methods:

First, check and clean the steel mesh

Check the position of the stencil template:

  • (1) Check the locking cylinder ring of the fixed stencil template for any looseness.
  • (2) Check if the stopper of the fixed stencil is loose.

Template cleaning:

  • (1) Residual solder paste on and around the template can affect adhesion, deposition, thickness, and overall solder quality. Regular cleaning of the template is essential for accurate printing. After a certain number of PCB boards are printed (depending on usage, generally every 1 to 3 prints of 0.3mm fine-pitch PCB boards), clean the bottom of the template. If not cleaned promptly, the template's apertures can easily become blocked by solder paste, affecting the quality of the printing.
  • (2) There are three methods for automatic cleaning: dry cleaning, wet cleaning, and vacuum cleaning. Use cleaning roll paper for the tool and industrial alcohol as the cleaning solution.
  • (3) According to the liquid level switch in the alcohol tank (located on the rear bracket of the machine), the liquid level of the cleaning solution is monitored during automatic cleaning. If the cleaning liquid level falls below the switch, the system will issue an alarm and indicate the cause. At this point, the alcohol tank should be refilled with industrial alcohol.

Steps:

  • (1) Turn off the air source switch on the lower left side of the machine.
  • (2) Open the rear cover of the machine and the lid of the alcohol tank.
  • (3) Pour the cleaning solution (industrial alcohol) into the tank.
  • (4) After filling the alcohol tank, replace the lid and close the rear cover.
  • (5) Turn the air supply back on.

Second, the printing section:

  1. Check if there is any solder paste residue on the printing workbench.
  2. Use a clean cotton cloth with a bit of alcohol to clean the area.
  3. Check for solder paste residue on the transmission system and positioning/clamping components.
  4. Remove the cover around the workbench and clean the guide bars and linear guides using a clean cotton cloth.
  5. Lubricate the guide screw and linear guides with NSK rail lubricant and special screw lubricant.
  6. Clean the sensors with a cotton cloth dampened with a little alcohol.
  7. Adjust the X and Y movement direction timing belts if needed.
  8. Replace the cover.

Third, the scraper system:

  1. Open the machine's front cover.
  2. Move the scraper beam to the appropriate position, loosen the screws on the scraper head, and remove the scraper pressure plate.
  3. Loosen the screws on the scraper blade and remove the blade.
  4. Clean the blade and scraper with a cotton cloth dipped in alcohol.
  5. Reinstall the blade press plate and scraper blade onto the scraper head.
  6. If the scraper blade is worn, it should be replaced.

Related Products:

  • Hot air reflow soldering machine
  • Motherboard repair machine
  • SMD micro components solution
  • SMT rework soldering machine
  • IC replacement machine
  • BGA chip reballing machine
  • BGA reball
  • IC chip removal machine
  • BGA rework machine
  • Hot air solder machine
  • SMD rework station

 

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