
Buy BGA Remover Automatic
Description
A BGA Remover Automatic is a specialized tool used in electronics manufacturing for removing Ball Grid Array (BGA)
components from circuit boards. It is an automated system that typically uses heat, suction, or a combination of both
to safely and efficiently remove the BGA component. The automatic feature can help reduce the risk of damage to the
surrounding components and the circuit board itself, and can increase the speed and efficiency of the rework process.


1.Application Of Hot Air
Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features

3.Specification of laser positioning
Ecellent technical details enable advanced functions and stability.
| power | 5300W |
| Top heater | Hot air 1200W |
| Bottom heater | Hot air 1200W.Infrared 2700W |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | K type thermocouple, closed loop control, independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm,Min 22*22 mm |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| BGAchip | 80*80-1*1mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(optional) |
| Net weight | 70kg |
4.Details of Infrared BGA Remover Automatic



5.Why Choose Our Infrared BGA Remover Automatic?


6.Certificate of Optical Alignment
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7.Packing & Shipment of CCD Camera

8.Shipment for BGA Remover Automatic Split Vision
DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.
9. Related knowledge
The tube is one of the earliest components used for amplifying electrical signals. It consists of a cathode electron-emitting portion, a control grid, an acceleration grid, and an anode (screen) lead, all enclosed in a glass container (generally a glass tube) that is welded to the tube base. An electric field is employed to inject an electronic modulation signal into the control grid within the vacuum, resulting in different parameter signal data after signal amplification or feedback oscillation is obtained at the anode.
While early applications in electronic products such as televisions and radio amplifiers have gradually been replaced by amplifiers and integrated circuits made of semiconductor materials in recent years, tubes with low noise and high stability are still used as audio power amplifier components in some high-fidelity audio equipment. In Hong Kong, people refer to tube power amplifiers as "amplifiers."
The vacuum tube has a cathode (K) that emits electrons and an anode or screen (P) that is typically charged with a high voltage during operation. The filament (F) is a very thin wire through which current is passed to generate light and heat, exciting the cathode to emit electrons. The grid (G) is positioned between the cathode and the screen.
The voltage applied to the grid suppresses the number of electrons passing through it, allowing for control of the current between the cathode and the anode.
To maintain the vacuum inside the tube, a component called a deaerator is placed within the vacuum tube. It is typically made from a live metal alloy such as bismuth, aluminum, or magnesium. After the air in the tube is evacuated, the components inside the tube and the deaerator are heated to a red heat so that any gas contained in the electrodes can be absorbed. The deaerator is rapidly sublimated by a high-frequency electromagnetic field surrounding the tube, allowing it to absorb the gas in the tube. After this reaction, a silver coating from the deaerator accumulates on the inner wall of the glass tube. If the glass tube is broken or leaks, the silver coating will fade, indicating that the vacuum tube can no longer be used.
Related products:
- Motherboard repairing machine
- SMD micro components solution
- SMT rework soldering machine
- IC replacement machine
- BGA chip reballing machine
- BGA reball
- IC chip removal machine
- BGA rework machine
- Hot air solder machine
- SMD rework station





