Laptop Motherboard Repair Tools

                                                     

Automatic 

For repairing motherboards, no matter whether you are a personal repairing shop or a factory, an automatic is

your necessary tool to desolder or solder.

1.Application Of Automatic Laptop Motherboard Repair Tools

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP,

PBGA,CPGA,LED chip.

2.Specification of Automatic

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

3.Details of Automatic 

5.Why Choose Our Automatic Laptop Motherboard Repair Tools?

6.Certificate of Automatic

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system,

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7.Packing & Shipment of Automatic 

8.Shipment for Automatic Laptop Motherboard Repair Tools

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support.

10. How DH-A2 Automatic Laptop Motherboard Repair Tools work?

How is the Motherboard (Board) Manufactured?

The PCB manufacturing process begins with glass epoxy (GlassEpoxy) or similar materials used to create the PCB substrate. The first step in production is to lay out the wiring between the components, using a subtractive transfer method.

This transfer method "prints" the circuit pattern onto the metal conductor. The process involves applying a thin layer of copper to the entire surface and removing the excess. In the case of a double-sided board, the substrate of the PCB will be covered with copper foil on both sides. For multi-layer boards, two double-sided panels are pressed together using special adhesives.

Next, the required components are drilled and plated onto the PCB. After drilling according to the specified requirements, the holes must be plated using plated-through-hole (PTH) technology. This ensures the internal layers are electrically connected to each other.

Before plating, any debris in the holes must be removed. This is necessary because the resin epoxy undergoes chemical changes when heated and can coat the inner PCB layer. Therefore, it must be removed first. Both the removal and plating processes are carried out chemically. Afterward, a solder resist (solder resist ink) is applied to the outermost wiring to prevent the wiring from contacting the plating areas.

Then, various component markings are printed on the circuit board to indicate the position of each part. These markings must not cover any wiring or gold fingers, as doing so could reduce solderability or the stability of the electrical connections. If there is a metal connection, the "golden finger" part is typically plated with gold to ensure high-quality electrical connections when the board is inserted into the expansion slot.

Finally, the PCB is tested. The tests check for shorts or open circuits, either optically or electronically. Optical scanning is used to detect defects in each layer, while electronic testing is typically done with a Flying-Probe to check all connections. Electronic tests are more accurate for finding short circuits or open circuits, but optical tests are better at detecting problems like incorrect gaps between conductors.

After the PCB substrate is complete, a finished motherboard is assembled by attaching various components to the PCB as needed. First, an SMT (surface-mount technology) automatic placement machine is used to "solder" the IC chips and chip components. Manual connections are made for some components that the machines cannot handle. Plug-in components are then fixed to the PCB through the wave/reflow soldering process, resulting in the production of the motherboard.

Additionally, if the board is to be used as a motherboard in a computer, it must be made into different form factors. The AT board type is one of the most basic and inexpensive designs, characterized by its simple structure. Its standard size is 33.2 cm × 30.48 cm. The AT board was designed to be used with the AT chassis power supply, but it has now been phased out. The ATX board is a larger version of the AT board, which facilitates better cooling for the CPU by the ATX chassis fan. Many of the external ports are integrated on the motherboard, unlike the AT board, which required separate connections for ports like COM ports and parallel ports.

The ATX small form factor supports up to four expansion slots, reducing size, power consumption, and cost.