BGA Reballing Hot Plate

Dinghua BGA Soldering Station with Integrated Heating and Cooling for BGA Reballing (Hot Plate Style).

Description

Product function

1. Composed of heating and cooling sections, the device cools immediately after heating is complete, improving the quality and efficiency of chip ball bonding;

2. The machine is compact and aesthetically pleasing;

3. Features an imported heating element, making it energy-efficient, environmentally friendly, and durable;

4. Adjustable temperature;

5. Simple to use, just turn on the switch;

6. Includes an early warning function to alert operators when processing is complete.

Products Paremeters

Heating Area：	120mm×200mm
Power：	600W
Temperature Setting：	Adjustable from room temperature to 300℃, with PID temperature control
Timer Alarm Range：	0.01s ～ 99.99h
Working Voltage：	AC 220V
Overall Dimensions：	310mm × 280mm × 145mm (L×W×H)
Net Weight：	7.5kg
Application:	BGA repair system welding machine, BGA rework station solder ball, BGA hot plate soldering station

Products description

1.Integrated reflow oven function, meeting the preheating, activation, heating and cooling requirements of solder paste.

2.Adopts digital display controller for temperature control and K-type thermocouple for temperature detection, featuring high temperature accuracy and minimal fluctuation.

3.Under the same conditions, it can solder BGA chips of different specifications simultaneously, with an alarm function activated upon completion of soldering.

4.Equipped with high-temperature resistant cloth to prevent damage to BGA chips.