Bga Rework Station for Laptop repair

1 Piece Min. Order Dimensions: 600*700*580mm Weight: 117KG Rated Capacity: 5300W Current: 20A Voltage: AC 110~240 V±10% 50/60Hz Rated Duty Cycle: 100%

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Description

Bga Rework Station for Laptop repair

Parameters

1	Total power	5300w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7 inch touch screen + intelligent temp control module + stepper motor driver + independent Mitsubishi PLC + LCD display + optical CCD system + laser positioning + industrial joystick
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (LWH)
10	Net weight	70 Kg

DH-A2E Automatic BGA Rework Station Features

Automatic Desoldering, Mounting, and Soldering: Automatically picks up the chip after desoldering is completed.
Automatic Chip Feeding System: Enables automated chip feeding during the rework process.
HD CCD Optical Alignment System: Ensures precise BGA and component mounting. The CCD lens features automatic folding and stretching.
Mitsubishi PLC Control: Uses an independent Mitsubishi PLC to control movements, ensuring stability and accuracy.
BGA Mounting Accuracy: Achieves a mounting accuracy of within 0.01mm, with a repair success rate of 99.9%.
Laser Positioning: Provides fast and accurate positioning for BGA chips and motherboards.
Top Airflow Adjustment: Equipped with an adjustable airflow button to meet the demands of small chips.
Superior Safety Features: Includes emergency protection functions for enhanced safety.
User-Friendly Operation: Features a multifunctional ergonomic system for easy and efficient use.

What can be repaired?

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