2 Heating Zones Touch Screen BGA Rework Station
The rework system have to heat a very narrow area on the board. DH-200 BGA rework station can be it exactly and easy. It is with very advanced technical know-how. Also as for the newest high density board, the parts of a fine lead pitch and chip size parts, it is possible for reworking correctly. Furthermore, DH-200 BGA rework station can complete all the processes of reworking, if it uses with the Jig. They are heating, removal, cleaning, printing. positioning, mounting, re-balling etc. and it is even inspection.
Description
1. Product Features of 2 Heating Zones Touch Screen BGA Rework Machine
Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;
Movable heating head, which is able to move freely horizontally, easy to operated;
Embedded industrial computer, PLC control, real-time profile display, able to display set profile and practically-tested profile; big size screen, easy to operate;
Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles, can input both English and Chinese;
The temperatures of the upper and lower hot air heaters can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the bottom area and the appropriate temperature-control settings make the rework
safer and more reliable.
2. Specification
| Power | 2300W |
| Top heater | Hot air 450W |
| Bottom heater | Hot air 1200W, Infrared 1800W |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L540*W310*H500 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | K type thermocouple, closed loop control. independent heating |
| Temperature accuracy | ±2°C |
| PCB size | Max 170*220 mm. Min 22*22 mm |
| Workbench fine-tuning | ±15mm forward/backward.±15mm righ/lieft |
| BGAchip | 80*80-2*2mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(oplional) |
| Net weight | 16kg |
3. Details of 2 Heating Zones Touch Screen BGA Rework Machine
1. 2 independent heaters ( hot air & infrared );
2. HD digital display ;
3. HD touchscreen interface, PLC control ;
4. Led headlamp ;
4. Why Choose Our 2 Heating Zones Touch Screen BGA Rework Machine?
5.Certificate
6.Packing & Shipment
7. Related Knowledge about the 2 Heating Zones Touch Screen BGA Rework Machine
Repair Method for Disconnection and Pad Drop-off on Mobile Phone Motherboard
- For the drop point and when the lead wire is below the pad, use a hot air gun (temperature: 240°C, air volume: medium) to blow off the soldered spot. Carefully dig out the tip with a blade, then apply a small amount of solder paste to the lead hole (pad). Use the hot air gun for reflow soldering to form a solder ball, and then wash with water. If the solder ball does not fall, it indicates that the wire is properly soldered and can be used normally.
- For disconnection and pad removal, first use a surgical blade to scrape away the broken lead, removing at least 3mm of material. Then, clean the area with flux (Tianna water). Use an electric iron to apply solder to the lead. Take a small section of enameled wire, which has been tin-bismuth-tin coated at the tip, and attach it to the scraped wire. Position the wire properly, then use a hot air gun (temperature: 280°C, air flow: medium) for welding. After welding, cut the enameled wire to a length of 2mm. Place a pin at the center of the pad, and use another pin to position the enameled wire around the pin to form a circle on the pad. Apply a small amount of solder paste to the circle, then use the hot air gun to reflow the solder, forming a solder ball.
If the lead wire and enameled wire are difficult to solder, apply a little solder paste to the joint, then use the hot air gun (without touching the wire with a soldering iron). Use a needle to adjust the position of the enameled wire to ensure it is straight and the solder joint is even. At this point, the pad is successfully repaired.
3. After all breakpoints are connected, clean the area with water. Be careful not to disturb the new pad. Apply a small amount of green oil around the line, avoiding the pad. Less is better-just enough to secure the wire. After applying, place the assembly under a purple lamp for half an hour to reinstall the IC. Even if disassembled and reassembled multiple times, the connection should remain secure.
