X-ray Inspection System For PCB

 

 

Dinghua Technology DH-X7 is a state-of-the-art X-ray inspection system for PCB device designed for evaluating the quality of PCBs and PCBA in detail. The DH-X7 provides imaging of electronic components at a high resolution and includes a wide variety of electronic components, including BGA, QFN and CSP packages, as well as other hidden lead packages.

 

This X-ray inspection equipment has been specifically designed to provide real-time, non-destructive analysis of multilayer PCBs, fine-pitch assemblies, and high-density BGAs, which allows determining defects such as voids, bridges, cracks, and misalignment with accuracy and rapid decisions regarding SMT production, repair and quality assurance.

 

PCB X-ray inspection is an advanced non-destructive method used to detect internal defects and ensure the overall quality of PCB assemblies. The PCB X-ray inspection technology allows operators to clearly visualize the internal structure of the PCB or motherboard, enabling precise analysis of hidden solder joints, multilayer connections, and other critical features. X ray for electronic components testing is an efficient way to detect PCB defects.

 

 

 

 

 

1. High-Resolution X-Ray Imaging

△ Advanced X-ray tube and flat-panel detector deliver high resolution images

△ Enables clear visualization of internal IC structures and hidden solder joints

 

2. Non-Destructive Internal Inspection

△ Confirms internal chip integrity without damaging components

△ Ideal for BGA, QFN, CSP, SOP, POP, and other hidden-lead packages

 

3. Precise Defect Detection

△ Identifies voids, solder bridges, micro-cracks, delamination, missing balls, misalignment, and wire-bond defects

△ Supports failure analysis, quality assurance, and incoming inspection

 

4. Real-Time Imaging & Multi-Angle View

△ Real-time dynamic imaging for fast analysis

 

5. High Penetration Power

△ Capable of inspecting dense materials, multilayer IC packages, and large BGA arrays

△ Suitable for high-density and high-thickness IC assemblies

 

6. User-Friendly Interface

△ Intuitive control software with automated functions and workflow templates

△ Simplifies operation for beginners while offering advanced settings for experts

 

7. Stable, Reliable, and Safe

△ Industrial-grade X-ray source with long lifespan

△ Multiple radiation safety protections and certifications

△ Low maintenance and high uptime for production environments

 

 

 

 

Whole machine status
Dimension	1100*1200*2100mm		Power supply	AC220V 10A
Weight	Appro 1200kg		Gross weight	About 1300kg
Packing	1300*1400*2200mm		Rated power	1000w
Open way	Manually		Inspection	Off-line
Uploading	Labor		Authorization	Password

 

 

 

 

 

X ray for electronic components is widely applied in many fileds. The X-ray inspection machine is widely used across the semiconductor and electronics manufacturing industries to evaluate internal structures, solder connections, and packaging integrity of IC components. Its non-destructive imaging makes it essential for quality control, failure analysis, and R&D.

 

1. Semiconductor Packaging Inspection

2. SMT & PCBA Assembly Inspection

3. Failure Analysis (FA) & Reliability Testing

4. Incoming Quality Control (IQC)

5. R&D and Process Optimization

6. Manufacturing Line Quality Assurance

7. Education, Training & Laboratory Use