IC Chips Infrared Preheating System Welding Table

1. hot air nozzles
2. laser positioning
3. hot air heating system
4. V-groove PCB support

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Description

IC Chips Infrared Preheating System Welding Table DH-A2E

Reballing BGA Ball and tin:

Reballing is a process used in electronics repair to replace the solder balls on a Ball Grid Array (BGA) chip. The process involves removing the old balls, cleaning the chip surface, and placing new, high-quality balls onto the chip.

The balls used in reballing are typically made of tin or a tin-lead alloy. These materials are chosen for their ability to create a strong bond with the chip and for their low melting points, which make the reballing process easier.

Tin is a common choice because it is lightweight and has good electrical conductivity. However, tin-lead alloy balls are preferred when the BGA will be exposed to higher temperatures, such as in automotive or industrial applications.

Overall, the choice between tin and tin-lead alloy balls depends on the specific needs of the electronics system being repaired.

Specifications

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high-resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (LWH)
10	Net weight	70 Kg

Applications

Widely used in chip level repairing in following products:
1. Laptop & desktop PCBA
2. Game console, such as Xbox one, Play Station 4 motherboards
3. Mobile phone PCBA, such as iPhone motherboards
4. TV&TV Set-top box motherboard
5. Server, Printer, Camera etc motherboard

Characteristic

A2E 内部发热系统

IC Chips Infrared Preheating System Welding Table DH-A2E

1,Widely used in chip-level repairing in mobile phones, small control boards or tiny motherboards etc.
2,Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED, etc.
3,Automatic desoldering, mounting, and soldering. Automatic pick-up chip when desoldering is completed.
4,HD CCD optical alignment system for precisely. mounting BGA and components.
5,BGA mounting accuracy within 0.01mm, repair success rate 99.9%
6,Superior safety function with emergency protection.
7,user-friendly operation, multi-functional ergonomic system.