Full Automatic Hot Air BGA Reballing Kit

Full Automatic Hot Air BGA Reballing Kit

1.Laser Positioning 2.optical alignment system 3.three independent heaters 4.powerful cross flow fan

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Description

Full Automatic Hot Air BGA Reballing Kit DH-A2E

A Full Automatic Hot Air BGA Reballing Kit DH-A2E is likely a device or kit used for reballing BGAs (Ball Grid Arrays),

which are a type of surface-mount integrated circuit package. The kit is designed to make the process of

reballing these components more convenient and efficient by using automated hot air tools to remove and replace

the solder balls that make up the BGA connections.

A2E Assemble

Applications:

The DH-A2E in the product name may refer to a specific model or version of the kit, which likely has certain features

or specifications that set it apart from other versions or similar products on the market. Without more information,

it's impossible to say exactly what those features might be, but they could include things like temperature control,

tool accuracy, or ease of use.

Characteristic:

A2E 内部发热系统

Full Automatic Hot Air BGA Reballing Kit DH-A2E

DH-A2E is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 1200W hot air top heater and a 2700W IR bottom preheater, saving you thousands in additional costs. it uses a unique infrared heating system to control and precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR thermal sensor, the process is completely closed loop temperature controlled using non-contact measuring methods.

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