Bga Chip Soldering Desoldering Station
Our infrared BGA reballing station features a dual-CCD optical alignment system for ±0.01mm precision, handling chips from 10x10mm to 90x90mm. Its intelligent 3-zone heating and computer control enable one-click, fully automated soldering and desoldering station operations. Designed as precision mobile phone IC repair equipment, it ensures repeatable, professional results.
Description
Product Overview
This fully automatic, vision-aligned soldering and desoldering station represents the pinnacle of precision in BGA repair. Designed for high-throughput and zero-defect requirements, it integrates advanced optical alignment, intelligent multi-zone heating, and computer-controlled automation to handle complex components from 10x10mm to 90x90mm with unparalleled accuracy. It is the ultimate mobile phone IC repair equipment for advanced workshops and production lines.
Core Technical Features
1. Dual-Vision Automatic Optical Alignment System
Utilizes twin high-definition CCD cameras (1.3MP) to capture real-time images of both the PCB and the BGA component.
Advanced image processing software performs automatic analysis and offset correction, achieving a repeat placement accuracy of ±0.01mm.
Enables fully automatic recognition and alignment for chips ranging from 10x10mm to 90x90mm, eliminating human error and ensuring perfect placement every time.
2. Advanced Multi-Zone Intelligent Heating System
Precise Control: Features 5 K-type thermocouples for closed-loop temperature feedback. Each of the three main heating zones employs independent PID algorithms for uniform and accurate heat distribution.
Superior Heating Design:
Upper Heater: Integrated hot-air nozzle and placement head, utilizing a fan-style heater.
Lower Heater: A square honeycomb-style hot-air heater with a unique thermal flow channel for precise bottom-side heating (requires clean, oil-free compressed air at 5 bar).
Infrared Preheater: A large-area carbon fiber infrared preheater with a high-temperature glass surface. This is the core of our infrared BGA reballing station, which prevents PCB warping during the entire rework process.
Unmatched Flexibility: Both upper and lower zones support 8-stage temperature profiles, which can be stored, recalled, and analyzed for different BGA types. The lower mobile heating zone can be programmed to move and adjust height automatically.
Rapid Cooling: A high-power cross-flow fan provides rapid cooling to solidify joints and prevent board deformation.
3. Automated Operation & Control System
Runs on a user-friendly Windows-based computer control system. Complex soldering and desoldering station operations are simplified into one-click functions for removal, placement, and reflow.
Achieves full automation: auto-alignment, auto-placement, auto-soldering, and auto-desoldering. The upper head uses a Panasonic servo system for precise independent control of height and placement.
Features automatic profile generation and report logging for quality traceability. The system maintains comprehensive work logs with massive storage for easy retrieval of historical data and parameters.
4. Comprehensive Safety & Protection System
Equipped with CE certification and features multiple safety protocols including an emergency stop switch and dual over-temperature protection with auto-shutdown.
Includes an audible "pre-alarm" function that alerts the operator 5-10 seconds before cycle completion.
The cooling system operates automatically until the board reaches a safe ambient temperature, prolonging machine lifespan.
Photoelectric safety grating is installed for operator protection during operation.
Products Parameters
| Parameter | Specification | |
|---|---|---|
| Total Power | Max 8000W | |
| Top Heater Power | 1200W | |
| Lower Heater Power | 800W | |
| Bottom Preheater Power | 4800W | |
| Power Supply | AC 220V ±10%, 50/60Hz | |
| Dimensions (L×W×H) | 1100×1100×1800 mm | |
| PCB Size | Max 480×490 mm, Min 10×10 mm | |
| Positioning | V-shaped slot + universal fixture | |
| V-shaped slot + universal fixture | ±0.01 mm | |
| Axis System | Servo motor (X, Y, Z, R rotation) | |
| Alignment System | 1×Top Vision Camera + 1×Bottom Vision Camera (1.3MP resolution) | |
| BGA Chip Size | 10×10 mm ~ 90×90 mm | |
| Temperature Control Accuracy | ±3°C | |
| Minimum Chip Spacing | 0.25 mm | |
| External Temperature Sensors | 5 ports | |
| Net Weight | Approx. 780 kg |
Products Details
Automatically Generate Temperature Curves, Real-time Observation & Analysis
PID Self-Tuning： Automatically Analyze & Correct Temperature | Precise Heating Temperature
Three-Zone Heating： Prevents PCB Deformation
Flexible & Versatile Positioning：Easily Accommodates PCBs of All Shapes
Anti-Crush Plate Clamp： The plate clamp features a spring-loaded telescopic design, preventing the motherboard from deforming due to thermal expansion during heating.
Temperature Interface：5 external temperature ports enable convenient real-time temperature monitoring, ensuring precise and reliable temperature control.
Air Volume Adjustment：Adjust air volume based on chip size and PCB thickness for more efficient rework.
Taiwan Cold Light LED Lighting：Shadowless LED illumination provides clear isibility during the entire rework process.
Key Distribution：Ergonomic key layout allows for more convenient and efficient operation.
Safety Light Curtain：Provides continuous protection to prevent operator injury during operation.
Screw Drive System：High-precision screw drive ensures accurate placement and long-lasting durability.
Self-Expanding Support Rod：Automatically extends to support PCBs, preventing deformation during heating.
Preheating Zone Control Switch：Independent control of each heating tube in the preheating zone ensures energy efficiency and eco-friendly operation.
