The DH-G760 represents the pinnacle of precision rework technology for LED manufacturing and repair. This advanced infrared soldering station integrates intelligent vision, automated feeding, and closed-loop thermal management into a single, user-centric platform. Engineered to tackle the most challenging miniaturized component rework, it dramatically improves yield, reduces operator skill dependency, and accelerates both prototyping and high-volume repair processes. By combining the accuracy required for micro-LEDs with the robust capabilities of a BGA workstation, it delivers unmatched versatility for modern electronics maintenance.

1.Intelligent Vision & Laser Dual-Alignment System

High-Precision Digital Vision Alignment: Utilizes a high-definition digital imaging system with auto optical zoom to achieve pixel-perfect alignment between components and pads, completely eliminating placement errors.

Laser-Assisted Positioning: An integrated laser guide provides a precise visual marker for rapid, single-step PCB loading, simplifying setup and improving initial positioning speed.

2.Fully Automated Feeding & High-Efficiency Operation

Integrated Tape Feeder: Accepts standard LED tape-and-reel packages for fully automatic pick-and-place. This eliminates slow, manual handling of individual beads, multiplying rework throughput.

Flexible Operational Modes: Offers both manual and fully automatic modes. Manual mode is ideal for process development and single repairs, while automatic mode enables programmable, hands-free batch rework for ultimate convenience.

3.Precision Closed-Loop Thermal Control & Real-Time Monitoring

±1°C High-Accuracy Control: A system built with high-precision K-type thermocouples, PLC logic, and dedicated temperature modules provides closed-loop control and automatic compensation, maintaining temperature stability within ±1°C.

Four External Temperature Ports: Allow for real-time profiling and calibration at multiple board locations, enabling meticulous process analysis and verification.

Real-Time Curve Analysis: The embedded industrial PC displays and compares set versus actual temperature curves in real-time, featuring tools for analysis and correction to ensure perfect process control.

4.Stable, Reliable Mechanics & Safety Design

Stepper Motion Control System: Drives X, Y, and Z-axis linear slides for stable, reliable movement capable of both fine micro-adjustments and rapid positioning to accommodate various PCB sizes and layouts.

Universal Protective Fixture: An adjustable, movable fixture securely holds PCBs of different sizes, protecting edge-mounted components and preventing board flex or damage.

High-Temp Glass Safety Shield: A durable glass cover over the preheat zone provides a clear view while effectively preventing LEDs and other small parts from falling into the machine interior, ensuring long-term operational safety.

Adjustable Micro-Airflow & Multi-Function Nozzles: The intelligent airflow system automatically adjusts wind speed based on component size, ensuring secure soldering of the smallest LEDs. Includes a set of 360° rotatable alloy nozzles in various sizes for easy installation and broad application.

5.User-Friendly Operation Interface

HD Touchscreen Control: An intuitive touchscreen HMI comes with pre-loaded, proven rework programs. This design minimizes the learning curve, allowing operators to achieve high-success-rate repairs without extensive specialized training.

Ergonomic & Secure Work Area: The preheating zone is protected by a robust high-temperature glass cover. This prevents accidental drop of components into the machine, ensuring safety and longevity.

Universal Fixturing System: A flexible, movable fixture secures various PCB sizes and protects delicate edge components from damage, accommodating diverse LED types and layouts.

Versatile Tooling: Equipped with multiple, rotatable alloy nozzles (360° rotation) for different component sizes, allowing quick changeover and optimal airflow direction.

This versatile BGA Workstation is not limited to LEDs. Its precise infrared heating and stable platform make it equally effective for:

Repairing LEDs on display modules (TV, monitor, commercial signage) and backlight units.

General SMD rework and prototyping.

Handling BGA and other complex package types, making it a true multi-role Infrared Rework Station for your lab or production floor.

Item	Parameter
Total Power	5200W
Top Heater Power	1200W
Bottom Heater Power	Zone 2: 1200W / Zone 3: 2400W
Power Supply	AC 220V ±10%, 50/60Hz
Dimensions (L×W×H)	670 × 800 × 1700 mm
Positioning Method	V-groove slot, X-axis adjustable PCB holder with universal fixture
Temperature Control	K-type thermocouple (K Sensor), closed-loop control
Temperature Accuracy	±1°C
Alignment Accuracy	0.01mm
Alignment System	HDMI high-definition digital imaging with auto optical zoom
PCB Size	Max: 420 × 450 mm / Min: 10 × 10 mm
Compatible LED Types	All types of LED beads
Min. LED Bead Spacing	0.1mm
External Temp. Sensor Ports	4 (expandable)
Machine Type	Floor-standing
Net Weight	130 kg

 

Products Details

Audible pre-alert: A clear beep sounds 5-10 seconds before process end.
Purpose: Gives the operator crucial time to ready for the next action.
Benefit: Guaranteeing a safe, prepared operation.

 

Auto-Extend / Retract Camera,Automatic feeding, automatic waste removal.

Optical HD Alignment：Equipped with an HD display screen, it ensures accurate placement of lamp beads and avoids misalignment and displacement.

Four external temperature sensor ports allow for real-time monitoring, ensuring more precise and reliable temperature control.

Smart Micro-Airflow Control automatically adjusts wind speed based on component size. This ensures efficient rework while securely holding even the smallest LEDs in place during soldering.

Infrared-Laser Hybrid Alignment System: This integrated system utilizes laser positioning for real-time, closed-loop feedback, achieving placement accuracy up to 99.9%.

Featuring a sleek, heat-resistant glass cover, the workstation maintains a clean aesthetic while effectively shielding the interior from dropped components, blending robust protection with modern design.

 

Supporting both manual control for process development and fully automatic operation for batch production, this flexibility optimizes workflows for prototyping and volume repair alike.