Optical Alignment BGA Removal Tool Kits

1.HD touch screen interface 2.top heater and nozzle 2 in 1 design 3.k sensor close loop control 4.sound hint system

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Description

Optical Alignment BGA Removal Tool Kits DH-A2E

Working Demo:

An Optical Alignment BGA Removal Tool Kit is a specialized set of tools used in the electronics industry for the precise removal and reinstallation of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These tools are particularly important for ensuring that BGA components, which have solder balls on their underside, are aligned accurately with the corresponding pads on the PCB during both removal and reattachment.

Desoldering BGA Ball and tin

Optical Alignment BGA Removal Tool Kits

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (LWH)
10	Net weight	70 Kg

Applications:

Optical Alignment BGA Removal Tool Kits

Characteristic:

A2E 内部发热系统

Optical Alignment BGA Removal Tool Kits DH-A2E

The DH-A2E is an infrared BGA rework station that can be widely used in electronic repair, such as for cell phones, desktops, switches, PS3, Wii, Xbox 360, and other areas of SMD reworking. It uses advanced infrared technology to provide even heat distribution and protect your eyes. The station uses IR heating elements with a total capacity of 2700W.

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