Ir Rework Station Reflow Station

Ir Rework Station Reflow Station

1. With serve motor to support optical CCD automatically running
2. Automaitc chip-feeder used for chips 1*1~55*55mm
3. Movable IR preheating area, +/-10mm
4. Double-joysticks for better users' experience

Description

 

                                                                                                                      DH-A4D Automatic Optical Alignment

 

 

Specification

Total Power

6800W

Top heater

1200W

Bottom heater

2nd 1200W, 3rd German IR infrared heater 4200W

Voltage

AC220V/110V ±10%      50Hz/60Hz

Operation  mode

Double joysticks operation.  Fully automatic positioning, soldering, cooling, integration.

Optical CCD camera lense

Automatic Frontward / backward, right / left, or  manual by joysticks

Camera magnification

2.0 million pixels(Digital zoom 10X-180X times)

Workbench fine-tuning:

±15mm forward/backward,  ±15mm  right/left

BGA positioning

Laser position, fast and accurate position of PCB  and BGA

Top airspeed

Can be adjusted by adjusting knob, prevent tiny  BGA from movement.

PCB Positioning

Intelligent positioning, PCB can be adjusted in X,  Y-direction with "5 points support" 

+ V-groove PCB bracket + universal  fixtures.

Temperature control

K sensor, close loop, PLC control, Servo driver

Placement accuracy:

±0.01mm

Temp accuracy

±1℃

Lighting

Taiwan led working light, any angle adjustable

Temperature profile storage

50000 groups

PCB size

Max 500×420 mm Min 22×22 mm

BGA chip

1x1 - 80x80 mm

Minimum chip spacing

0.1mm

External temper sensor

4pc

Dimension

790x60x950mm

Net weight

95KG

 

 

Illustration for main parts as below:

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Ir Rework Station Reflow Station Application

Complete range of rework applications in medium and large scale service centers, 

mobile and radio systems devises repair, mobile phones, PDAs, handhelds, laptops, 

notebooks, portable medical equipment LAN devices, network nodes, military 

communication equipment, etc.

  1.  

2. Applicable to repair all kinds of chips, such as BGA, PGA, POP, BQFP, QFN, PLCC, 

TQFP, TSOP, etc. with tin in lead and lead-free.

 

Packaging Information

Materials: Strong wooden case+wooden bars+proof foams with film

Dimension: 85*67*103CM

Gross weight: 130kg

Packing List

  • 1pc BGA Rework     Machine  

  • 1pc brush pen                              

  • 1pc     Instruction Manual          

  • 1pc CD video                              

  • 3pcs top     nozzles                        

  • 2pcs bottom     nozzles            

  • 6pcs universal     fixtures        

  • 6pcs fastened     screws          

  • 4pcs support     screw              

  • 1pc tweezer                        

  • Sucker size:     Diameters in 2,4,8,10,11mm                            

  • Inner hexagon     spanner: M2/3/4

 

Our Services

 

At pre-sales, free for demonstration and information consults, on-site or by video.

01

Can provide process video or training before shipment, at your need.

02

At after-sales, with a strong professional technical back-up team.

03

Offer a huge discount for massive order volume or for repeated orders.

04

Warranty: 1 year for free, and to receive parts cost for the further years.

05

Company Information

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Contact Us

Email: john@dh-kc.com

WhatsApp/Wechat/Mob:+86 157 6811 4827 

 

Warmly welcome the world-wide business partners to consult us and visit our factory!

 

 

 

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