Reballing Station Ir Rework Station Reflow Station

DH-A4D hi-tech end with special quality assembly intelligent optical alignment BGA rework station

Specification

 

Total Power	6800W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd German IR infrared heater 4200W
Voltage	AC220V/110V ±10％      50Hz/60Hz
Operation  mode	Double joysticks operation.  Fully automatic positioning, soldering, cooling, integration.
Optical CCD camera lense	Automatic Frontward / backward, right / left, or  manual by joysticks
Camera magnification	2.0 million pixels(Digital zoom 10X-180X times)
Workbench fine-tuning:	±15mm forward/backward,  ±15mm  right/left
BGA positioning	Laser position, fast and accurate position of PCB  and BGA
Top airspeed	Can be adjusted by adjusting knob, prevent tiny  BGA from movement.
PCB Positioning	Intelligent positioning, PCB can be adjusted in X,  Y-direction with "5 points support" + V-groove Pcb bracket + universal  fixtures.
Temperature control	K sensor, close loop, PLC control, Servo driver
Placement accuracy:	±0.01mm
Temp accuracy	±1℃
Lighting	Taiwan led working light, any angle adjustable
Temperature profile storage	50000 groups
PCB size	Max 500×420 mm Min 22×22 mm
BGA chip	1x1 - 80x80 mm
Minimum chip spacing	0.1mm
External temper sensor	4pc
Dimension	790x60x950mm
Net weight	95KG

Application

1. Complete range of rework applications in medium and large scale service centers, mobile and radio systems devises repair,

2. mobile phones, PDAs, handhelds, laptops, notebooks, portable medical equipment LAN devices, network nodes, military

3. communication equipment, etc.

2. Applicable to repair all kinds of chips, such as BGA, PGA, POP, BQFP, QFN, PLCC, TQFP,TSOP, etc. with tin in lead and lead-free.

Services

1. At pre-sales, free for demonstration and information consults, on-site or by video. 
2.Can provide process video or training before shipment, at your need. 
3. At after-sales, with a strong professional technical back-up team.

4. Offer a huge discounts for massive order volume or for repeated orders.

5.Warranty: 1 year for free, and to receive parts cost for the further years.

How does the automatic BGA rework station work?

FAQ

1. How about the package? Is it safe during the delivery? 

All mobile phone LCD refurbished machine is packed Safely, by standard strong wooden carton or carton box with foam inside.

2. What is the delivery way? How many days will the machine come to us ? 

We will ship the machine by DHL, FedEx, UPS, etc (Door to Door Service), around 5 days to arrive.

Or by Air to your airport (Door to Airport Service ), around 3 days to arrive. 

Or by Sea to the seaport,  Minimum CBM requirement: 1 CBM, around 30 days to arrive.

3. Do you provide the Warranty? How about the after-sales service?

1 year warranty free for spare parts, Whole life technical support.

We have professional after-sales team, if any question, assistant videos are also provided in after-sale service.

4.This machine is easy to operate? if I have no experience, Can I also operate it well?

Do you provide the user manual and operating videos to support us?

Yes, our  machines are designed to use easily, Normally it will take you 2-3 hours to learn how to operate, if you are a technician, it will be much faster to learn. We will provide the English user manual for free, and the operation video is available.

5, If we come to your factory, you will provide free training?

Yes, warmly welcome to visit our factory, we will arrange the free training for you.

6. What is the payment way?

We accept the payment terms: Bank transfer, Western Union, Money Gram, Paypal, etc.

There are four basic types of BGA: PBGA, CBGA, CCGA, and TBGA, and the bottom of the package is generally

connected to a solder ball array as an I/O lead-out. The typical spacing of the solder ball arrays in these packages is

1.0mm, 1.27mm, 1.5mm. 

The common lead-tin components of the solder balls are mainly 63Sn/37Pb and 90Pb/10Sn. Standards vary from company to company. From the perspective of BGA assembly technology, BGA has more superior characteristics than QFP devices, which is mainly reflected in the fact that BGA devices have less strict requirements for mounting accuracy. The offset of the pad is as much as 50%, and the position of the device can be automatically corrected due to the surface tension of the solder. This situation has been proved to be quite obvious by experiments. Secondly, BGA no longer has the problem of pin deformation similar to QFP and other devices, and BGA also has better coplanarity than QFP and other devices, and its lead-out spacing is much larger than that of QFP, which can significantly reduce soldering Paste printing defects lead to the problem of "bridging" of solder joints;

 in addition, BGA has good electrical and thermal characteristics, as well as high interconnection density. The main disadvantage of BGA is that it is difficult to detect and repair solder joints, and the reliability requirements for solder joints are relatively strict, which limits the application of BGA devices in many fields.