BGA Soldering Station Mobile Phone Repair
Features: Split vision, automatic soldering and desoldering, imported CCD alignment system, independent controlling system, etc.
Description
The most popular model DH-A2 BGA soldering station for mobile phone repair
It is widely used in computers, cellphones, multimedia devices, and set-top boxes, as well as in military products such as missiles, aircraft, and radar systems.
A BGA Soldering Station for Mobile Phone Repair is a specialized rework machine designed to accurately desolder and solder BGA (Ball Grid Array) chips on mobile phone logic boards. It typically includes:
- Hot air or infrared heating modules (top + bottom or IR pre‑heat)
- PID closed‑loop temperature control
- Optional vacuum pickup for chip handling
- CCD vision or laser alignment systems for chip positioning
- LCD or touchscreen display for temperature control and presets
parameter
| Power supply | 110~250V 50/60Hz |
| power rating | 5400W / 20A |
| Power plug | option as per different requirements |
| Alignment |
split vision, micrometer adjusting, HD monitor imaging |
| PCB size available | 20*20~430*450mm |
| component size available |
1*1~80*80mm |
| Working models | soldering, desoldering, and positioning |
| mounting pressure | ＜ 0.2N |
| mounting accuracy | 0.01mm |
| Temperature precision | 1 ℃ |
| Dimension | 600*700*850mm |
| Weight | 70kg |
The BGA soldering station mobile phone repair DH-A2 details
Monitor the screen and optical CCD alignment system, simple and efficient to put a component on the right position of
a motherboard.
A chip picked up for soldering, desoldering or position, one of the models is OK, the system will automatically go into the next step.
A bright LED can be flexible for different positions on a PCB, which ensures convenient working conveniently.
No matter a PCB with any shape can be fixed on the working table as below for soldering and desoldering.
Features of BGA Soldering Station DH-A2
- Embedded industrial computer with a high-definition touchscreen human-machine interface (HMI), PLC control, and real-time curve analysis. It displays both the settings and actual temperature curves in real time and allows for analysis and correction of the curve.
- High-precision K-type thermocouple closed-loop control with an automatic temperature compensation system. Integrated with PLC and a temperature module, it ensures accurate temperature control with a deviation of ±1 °C. An external temperature measurement interface enables precise temperature detection and accurate analysis and correction of the measured temperature curve.
- Step-motion control system for stable, reliable, safe, and efficient operation. A high-precision digital video alignment system is adopted. The PCB positioning uses a V-shaped groove and linear sliding seat, allowing fine or quick adjustments along the X, Y, and Z axes. This ensures convenient and precise positioning, accommodating various PCB layouts and sizes.
- Flexible, removable universal fixture protects the PCB, prevents damage to edge-mounted components, and avoids PCB deformation. It is compatible with a wide range of BGA package sizes for rework.
- Equipped with multiple alloy air nozzles, which can rotate and be positioned 360 degrees. Easy to install and replace.
- The upper and lower heating zones are divided into three independently controlled temperature zones. These zones can simultaneously perform multi-stage temperature control, ensuring optimal soldering results across different heating areas. Heating temperature, time, ramp rate, cooling, and vacuum settings are all adjustable via the display unit.
Packing and Shipping
- Packaging: Plywood box (no fumigation required), with internal foam padding and reinforced bars.
- Dimensions: 82 × 77 × 87 cm
- Gross weight: 110 kg
Shipping options: DHL, TNT, UPS, FedEx, air freight, sea freight, or other special logistics lines, according to customer requirements.
