Mobile Phone Motherboard Re-work Machine

Mobile Phone Motherboard Re-work Machine

Operation Demo:

Remove BGA Ball and tin

Specifications

Specifications

Total Power	5200W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd IR heater 2700W
Voltage	AC220V/110V±10％ 50Hz
Feeding system	Auto feeding system for chip
Operation mode	Two modes: manual and automatic, free choose! HD touch screen, intelligent human-machine, digital system setting.
Temperature profile storage	50,000 groups(un-limited number of groups)
Optical CCD camera lens	Automatic stretching out and folding to pick and place BGA chip
Camera magnification	1.8 million pixels
Workbench fine-tuning:	±15mm forward/backward, ±15mm right/left
Placement accuracy:	±0.015mm
Bga positioning	Laser positioning, fast and accurate position of PCB and BGA
PCB position	Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groove pcb bracket + universal fixtures.
Lighting	Taiwan led working light, any angle adjustable
Temperature control	K sensor, close loop, PLC control
Temp accuracy	±2℃
PCB size	Max 450×400 mm Min 22×22 mm
BGA chip	1x1 - 80x80 mm
Minimum chip spacing	0.015mm
External temper sensor	1pc
Dimensions	L740×W630×H710 mm
Net weight	70KG

 Application

Characteristic:

Features Summary

• Widely used for chip-level repairs in laptops, PS3, PS4, XBOX360, mobile phones, computers, TVs, control boards, etc.
• Reworks BGA, CCGA, QFN, CSP, LGA, SMD, LED, and more.
• Automatic desoldering, mounting, and soldering; automatically picks up the chip once desoldering is complete.
• HD CCD optical alignment system for precise mounting of BGAs and components.
• BGA mounting accuracy within 0.01mm, with a repair success rate of 99.9%.
• Laser positioning for fast alignment of the BGA chip and motherboard.
• Superior safety functions, including emergency protection.
• User-friendly operation with a multi-functional ergonomic system.

Packing List

   

Materials: Strong wooden case+wooden bars+proof pearl cottons with film

1pc  Re-work Machine 

1pc brush pen                      

1pc Instruction Manual          

1pc CD video                      

3pcs top nozzles                    

2pcs bottom nozzles            

6pcs universal fixtures        

6pcs fastened screws          

4pcs support screw              

1pc tweezer                    

Sucker size: Diameters in 2,4,8,10,11mm                        

Inner hexagon spanner: M2/3/4

Dimension:81*76*85CM

Gross weight: 115 kg  

   

FAQ

1,How is the packaging? Is it safe during delivery?
The machine is securely protected with a strong wooden case, wooden bars, proof pearl cotton, and film to ensure safe delivery.

2,What is the delivery method? How many days will it take to arrive?
Delivery is primarily via courier (DHL, FedEx, UPS, etc.), with an estimated arrival time of 5 days. Alternatively, it can be shipped by air to your nearest airport (Door-to-Airport Service), arriving in about 3 days, or by sea with a minimum CBM requirement of 1 CBM, taking around 30 days.

3,Do you provide a warranty? How is the after-sales service?
The machine comes with a 1-year warranty and free technical support. We also provide instructional videos to assist with the machine's operation.

4,Is the machine easy to operate? Can I use it even if I have no prior skills?
Yes, our machines are designed for easy operation. It usually takes 2-3 hours to learn how to use the machine. If you have some experience, it will be even easier.

5,If we visit your factory, will you provide free training?
Absolutely! You are warmly welcome to visit our factory for free training.

6,What are the payment terms?
We accept T/T, Western Union, MoneyGram, PayPal, and more.

Specification:

Total Power	5200W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd IR heater 2700W
Voltage	AC220V/110V±10％ 50Hz
Feeding system	Auto-feeding system for chip
Operation mode	Two modes: manual and automatic, free choose! HD touch screen, intelligent human-machine, digital system setting.
Temperature profile storage	50,000 groups(unlimited number of groups)
Optical CCD camera lens	Automatic stretching out and folding to pick and place BGA chip
Camera magnification	1.8 million pixels
Workbench fine-tuning:	±15mm forward/backward, ±15mm right/left
Placement accuracy:	±0.015mm
Bga positioning	Laser positioning, fast and accurate position of PCB and BGA
PCB position	Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groove pcb bracket + universal fixtures.
Lighting	Taiwan led working light, any angle adjustable
Temperature control	K sensor, close loop, PLC control
Temp accuracy	±2℃
PCB size	Max 450×400 mm Min 22×22 mm
BGA chip	1x1 - 80x80 mm
Minimum chip spacing	0.015mm
External temper sensor	1pc
Dimensions	L740×W630×H710 mm
Net weight	70KG