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Bga Chip Removal Machine

Professional BGA Chip Desoldering and Soldering Machine | Advanced Mobile Repairing Tools | High-Precision SMD Soldering Station

Description

Product Overview

 

Elevate your repair workshop with our all-in-one BGA chip desoldering and soldering machine DH-A7. This station is engineered to be the core of modern mobile repairing tools, integrating the precision of a high-end SMD soldering station with robust rework capabilities. It is designed for efficient, accurate, and safe processing of BGA, CSP, QFN, and other delicate SMD components.

Key Features 

 

1.Intelligent Control & Precision Heating

HD Touchscreen & PLC: The intuitive interface of this SMD soldering station provides real-time display and analysis of temperature curves. Users can set, monitor, and correct profiles directly on-screen, ensuring perfect results for every BGA chip desoldering and soldering task.

 

Advanced Temperature System: A high-precision K-type thermocouple system, managed by PLC, achieves closed-loop control with automatic compensation. It maintains temperature accuracy within ±5°C, a critical standard for professional mobile repairing tools.

 

2.Advanced Motion & Vision Alignment System

Stepper & Servo Control: Ensures stable, reliable, and automated positioning. This BGA chip desoldering and soldering machine features a high-resolution digital vision system for fast, accurate PCB alignment, accommodating various board sizes and layouts.

Universal Protection: The movable universal fixture protects PCB edges and components from damage, making it a versatile asset among mobile repairing tools.

 

3.Multi-Zone Independent Heating & Superior Cooling

Three Independent Zones: Upper, lower, and middle heating zones operate independently with 8-segment programmable control. This multi-zone approach, a hallmark of a premium SMD soldering station, guarantees even heating and optimal soldering profiles for complex boards.

Rapid Cooling: An integrated high-power cross-flow fan quickly cools the PCB after rework to prevent warping or damage, completing the automated cycle of this BGA chip desoldering and soldering machine.

 

4.Enhanced Usability & Safety

Versatile Tooling: Includes multiple, rotatable alloy nozzles for easy access to different component layouts.

Smart Alerts & Storage: Features a voice prompt for operation completion and can store up to 50,000 temperature profiles for instant recall.

Complete Safety: As CE-certified essential mobile repairing tools, it includes emergency stop buttons and automatic fault protection for safe operation.

 

Products Parameters 

Parameter Specification  
Total Power 11500W  
Top Heater Power 1200W  
Lower Mobile Heater Power 800W  
Bottom Preheater Power 9000W (German heating tube, heating area 860×635mm)  
Power Supply AC380V±10%, 50/60Hz  
Dimensions (L×W×H) 1460×1550×1850 mm  
Operation Mode Automatic integrated desoldering, soldering, suction, and placement  
Temperature Profile Storage 50,000 sets  
Optical CCD Lens Movement Auto-extend/retract; can be freely moved via joystick to eliminate observation blind spots  
PCBA Positioning V-groove slot; PCB holder adjustable in X-direction with universal fixture  
BGA Positioning Laser positioning for quickly aligning the center points of the upper/lower heaters and the BGA  
Temperature Control Method K-type Thermocouple (K Sensor), Closed-loop control  
Temperature Control Accuracy ±3°C  
Repeat Placement Accuracy ±0.01mm  
PCB Size Max: 900×790 mm / Min: 22×22 mm  
Applicable Chip (BGA) 2×2 mm to 80×80 mm  
Minimum Chip Pitch 0.25mm  
External Temperature Sensor Ports 5  
Net Weight Approx. 120 kg  

 

Products Details

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  • Shenzhen DinghuaTechnology
  • Shenzhen Dinghua Technology
  •  

    Shenzhen Dinghua Technology
  • Shenzhen Dinghua Technology

Certifications

 

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Cooperation

 

 

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