Bga Chip Removal Machine
Professional BGA Chip Desoldering and Soldering Machine | Advanced Mobile Repairing Tools | High-Precision SMD Soldering Station
Description
Product Overview
Elevate your repair workshop with our all-in-one BGA chip desoldering and soldering machine DH-A7. This station is engineered to be the core of modern mobile repairing tools, integrating the precision of a high-end SMD soldering station with robust rework capabilities. It is designed for efficient, accurate, and safe processing of BGA, CSP, QFN, and other delicate SMD components.
Key Features
1.Intelligent Control & Precision Heating
HD Touchscreen & PLC: The intuitive interface of this SMD soldering station provides real-time display and analysis of temperature curves. Users can set, monitor, and correct profiles directly on-screen, ensuring perfect results for every BGA chip desoldering and soldering task.
Advanced Temperature System: A high-precision K-type thermocouple system, managed by PLC, achieves closed-loop control with automatic compensation. It maintains temperature accuracy within ±5°C, a critical standard for professional mobile repairing tools.
2.Advanced Motion & Vision Alignment System
Stepper & Servo Control: Ensures stable, reliable, and automated positioning. This BGA chip desoldering and soldering machine features a high-resolution digital vision system for fast, accurate PCB alignment, accommodating various board sizes and layouts.
Universal Protection: The movable universal fixture protects PCB edges and components from damage, making it a versatile asset among mobile repairing tools.
3.Multi-Zone Independent Heating & Superior Cooling
Three Independent Zones: Upper, lower, and middle heating zones operate independently with 8-segment programmable control. This multi-zone approach, a hallmark of a premium SMD soldering station, guarantees even heating and optimal soldering profiles for complex boards.
Rapid Cooling: An integrated high-power cross-flow fan quickly cools the PCB after rework to prevent warping or damage, completing the automated cycle of this BGA chip desoldering and soldering machine.
4.Enhanced Usability & Safety
Versatile Tooling: Includes multiple, rotatable alloy nozzles for easy access to different component layouts.
Smart Alerts & Storage: Features a voice prompt for operation completion and can store up to 50,000 temperature profiles for instant recall.
Complete Safety: As CE-certified essential mobile repairing tools, it includes emergency stop buttons and automatic fault protection for safe operation.
Products Parameters
| Parameter | Specification | |
|---|---|---|
| Total Power | 11500W | |
| Top Heater Power | 1200W | |
| Lower Mobile Heater Power | 800W | |
| Bottom Preheater Power | 9000W (German heating tube, heating area 860×635mm) | |
| Power Supply | AC380V±10%, 50/60Hz | |
| Dimensions (L×W×H) | 1460×1550×1850 mm | |
| Operation Mode | Automatic integrated desoldering, soldering, suction, and placement | |
| Temperature Profile Storage | 50,000 sets | |
| Optical CCD Lens Movement | Auto-extend/retract; can be freely moved via joystick to eliminate observation blind spots | |
| PCBA Positioning | V-groove slot; PCB holder adjustable in X-direction with universal fixture | |
| BGA Positioning | Laser positioning for quickly aligning the center points of the upper/lower heaters and the BGA | |
| Temperature Control Method | K-type Thermocouple (K Sensor), Closed-loop control | |
| Temperature Control Accuracy | ±3°C | |
| Repeat Placement Accuracy | ±0.01mm | |
| PCB Size | Max: 900×790 mm / Min: 22×22 mm | |
| Applicable Chip (BGA) | 2×2 mm to 80×80 mm | |
| Minimum Chip Pitch | 0.25mm | |
| External Temperature Sensor Ports | 5 | |
| Net Weight | Approx. 120 kg |
Products Details


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