Manual BGA Repair Machine
Dinghua BGA rework station DH-5830 is a manual BGA repair machine widely uesd in repairing, removing, and replacing Ball Grid Array (BGA) components on printed circuit boards (PCBs).Such as CPUs, GPUs, memory ICs, chipsets,BGA chips on PCBs in laptops, smartphones, game consoles, servers, and other electronic devices.
Description
Products Description
Equipped with three-zone independent temperature control ( infrared preheating area, top and bottom hot air nozzles), and precision tools like a vacuum suction pen and laser red dot positioning, this rework station provides stable, efficient, and precise rework capability. It is widely used in repairing motherboards, communication boards, industrial control systems, and other electronic assemblies.
| Item | Parameter |
| Power Supply | AC220V±10％ 50Hz |
| Rated Power | 5500W |
| Top Power | 1200w |
| Bottom Power | 1200w |
| Infrared Power | 3000w |
| Top air-flow knob | For upper hot-air flow adjusting(especially, very small/big chips) |
| Operation Mode | HD touch screen, digital system setting |
| Temperature Profile Storage | 50000 groups |
| Temperature Control | K Sensor + Closed Loop |
| Top heater movement | Right/left, frontward/backward, rotate freely |
| Temp accuracy | ±2℃ |
| Positioning | Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov pcb bracket + universal fixtures |
| PCB size | Max 410×370 mm Min 22×22 mm |
| BGA chip | 2x2 - 80x80 mm |
| Minimum chip spacing | 0.15mm |
| External temper sensor | 1pc |
| Dimensions | 570*610*570mm |
| Net weight | 35KG |
Detailed Images
The nozzle was made by titanium alloy, it can rotate 360°, with magnetic.
Custom Fit : Available in multiple sizes to match different BGA/SMT chips.
Efficient Heating : Focused airflow ensures rapid and uniform heating.
Component Protection : Prevents heat from spreading to nearby sensitive devices.
Easy Installation : Quick-change design for convenient operation.
A vacuum suction pen is an auxiliary tool integrated into a BGA rework station, designed for the safe handling of electronic components during repair and rework processes.
High Precision : Ensures accurate placement on PCB pads.
User-Friendly : Simple one-touch suction and release operation.
Versatile Use : Suitable for BGA, QFP, SOP, and other SMT components.
Integrated with Rework Station : Conveniently connected to the system for stable suction power.
Multifunctional fixtures are specially designed holders used in a BGA rework station to secure and stabilize printed circuit boards (PCBs) during repair and rework.
Adjustable Design : Accommodates various PCB sizes and shapes.
Firm Clamping : Prevents board vibration, shifting, or warping during heating.
High-Temperature Resistance : Made from durable materials that withstand infrared and hot-air heating.
Easy Operation : Quick installation and adjustment for different repair tasks.
The IR (infrared) preheating zone is designed to uniformly preheat the printed circuit board (PCB) before the soldering or desoldering process.
Uniform Heating : Ensures consistent temperature distribution across the PCB.
Reduced Thermal Stress : Protects sensitive chips and prevents board deformation.
Energy Efficient : Infrared heating provides quick and stable preheating.
Improved Rework Quality : Creates the right thermal balance for precise soldering.
Products Features
1. With vacuum sucker, pick up the bga chip conveniently after desoldering.
2. With USB 2.0 interface, can be connected with a computer or mouse, screenshot temperature curve or future system update.
3. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters.
4. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
5. Adopt three heating zone, upper and low heater hot air, bottom heater is infrared preheating zone.
6. K type close loop control, temperature accuracy will be on ±2°C.
7. High power cross flow cooling fan, prevent the PCB from deformation.
8. Sound hint system: there is voice reminder 5s-10s before the completion of heating, to get the operator prepared.
9. Security measure: overheat guard.
Our Company
FAQ
Q: What is a BGA rework station?
A: A BGA rework station is a machine used to remove, repair, and replace BGA (Ball Grid Array) chips on printed circuit boards (PCBs) by heating them in a controlled way. It helps fix or replace faulty chips in devices like laptops, smartphones, and game consoles.
Q: Are you a manufacturer or trade company?
A: We are a manufacturer specilize in BGA rework station, X-ray counting machine, X-ray inspection machine, automatic equipment, SMT related equipment and etc.
Q: Where is your factory?
A: 4th F 6B, Shengzuozhi Technology Park, Xinqiao/518125, Bao'an, Shenzhen, Guangdong, China.
Q: What service can you privide?
A: 1. Professional after-sales service, free technical consultation and video demonstration available. 2. 1-year warranty for the entire machine (excluding consumables). 3. OEM and ODM services are welcomed. 4. Payment methods: T/T, Western Union, etc. 5. Fast delivery options include FedEx, DHL, UPS, EMS, etc.
Q: Do you provide the user manual and operation video?
A: Provide the English user manual for free, operation video is available. Operation language is English and Chinese.
