IR Preheating BGA IC Chips Remove Machine
1. Upper/bottom hot-air for soldering or desoldering. 2. Monitor screen 15" 1080P. 3. Automatic alarm 5~10s before its desoldering will be over 4. Magnetic nozzles which are very convenient to install or uninstall
Description
Operation guide for the BGA rework station DH-A2
The DH-A2 is a cost-effective model among those machines with optical alignment, automatically solder, desolder, pick up and replace.
Universal fixtures are used for any shape of PCBAs, laser point can help quickly put a PCB at a proper position, the movable workbench is convenient for a PCB leftward or rightward.
1. Application of IR preheating BGA IC chips remove machine
To solder, reball, desolder a different kind of chips:
BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chips, and so on.
2. Product Features of IR preheating BGA IC chips remove machine
* Stable and long lifespan(designed for 15 years using)
* Can repair different motherboards with high successful rate
* Strictly control heating and cooling temperature
* Optical alignment system: mounting accurately within 0.01mm
* Easy to operation. Anyone can learn to use it in 30 minutes. No special skill is needed.
3. Specification of IR preheating BGA IC chips remove machine
| Power supply | 110~240V 50/60Hz |
| Power rate | 5400W |
| Auto level | solder, desolder, pick up and replace, etc. |
| Optical CCD | automatic with a chip feeder |
| Running control | PLC (Mitsubishi) |
| chip spacing | 0.15mm |
| Touchscreen | curves appearing, time and temperature setting |
| PCBA size available | 22*22~400*420mm |
| chip size | 1*1~80*80mm |
| Weight | about 74kg |
4. Details of IR preheating BGA IC chips remove machine
1. Top hot-air and a vacuum sucker installed together, which is conveniently picking up a chip/component for aligning.
2. Optical CCD with a split vision for those dots on a chip vs motherboard imaged on a monitor screen.
3. The display screen for a chip(BGA,IC,POP and SMT,etc.) vs its matched motherboard's dots aligned before soldering.
4. 3 heating zones, upper hot-air, lower hot-air and IR preheating zones, which can be used for small to iPhone motherboard, also,up to computer ann TV mainboards, etc.
5. IR preheating zone covered by steel-mesh, which makes heating elements evenly and safer.
6. Operation interface for time and temperature setting, temperature profiles can be stored as many as 50,000 groups.
5. Why Choose Our Automatic SMD SMT LED BGA rework station?
6. Certificate of BGA rework system computer repair machine
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.
7. Packing & Shipment of Automatic BGA rework reballing machine
8. Shipment for the BGA rework station
DHL, TNT, FEDEX, SF, Sea transportation and other special lines,etc.. If you want another shipping term, please tell us. We will support you.
9. Terms of Payment
Bank transfer, Western Union, Credit Card.Please tell us if you need other support.
10. The relevant knowledge for automatic reballing infrared BGA repair machine
Using a BGA rework station can be roughly divided into three steps: desoldering, placement, and soldering. Below, we take the BGA rework station DH-A2 as an example:
Desoldering:
1,Preparation for Repair: Determine the air nozzle to be used for the BGA chip being repaired. The rework temperature is set according to whether leaded or lead-free solder is used by the customer, as the melting point of leaded solder balls is generally 183°C, while the melting point of lead-free solder balls is around 217°C. Fix the PCB motherboard on the BGA rework platform and align the red laser spot at the center of the BGA chip. Lower the placement head to determine the correct placement height.
2,Set the Desoldering Temperature: Store the temperature setting so it can be recalled for future repairs. In general, the temperature for desoldering and soldering can be set to the same value.
3,Start Desoldering: Switch to disassembly mode on the touch screen interface and click the repair button. The heating head will automatically lower to heat the BGA chip.
4,Completion: Five seconds before the temperature cycle ends, the machine will sound an alarm. Once the temperature curve is completed, the nozzle will automatically pick up the BGA chip, and the placement head will lift the BGA to the initial position. The operator can then connect the BGA chip to the material box. Desoldering is now complete.
Placement and Soldering:
1,Placement Preparation: After the tin removal from the pad is complete, use a new BGA chip or a reballed BGA chip. Fix the PCB motherboard and approximately position the BGA on the pad.
2,Start Placement: Switch to placement mode, click the start button, and the placement head will move down. The nozzle will automatically pick up the BGA chip and move it to the initial position.
3,Optical Alignment: Open the optical alignment lens, adjust the micrometer, and align the PCB on the X and Y axes. Adjust the BGA angle with the R angle. The solder balls (displayed in blue) on the BGA and the solder joints (displayed in yellow) on the pad can be seen in different colors on the display. After adjusting so that the solder balls and joints completely overlap, click the "Alignment Complete" button on the touch screen.
4,Completion: The placement head will automatically lower, place the BGA on the pad, and turn off the vacuum. The head will then rise by 2-3mm and begin heating. Once the temperature curve is completed, the heating head will rise to the initial position. Soldering is complete.
Soldering:
This function is used for BGAs that are poorly soldered due to low temperature and require reheating.
1,Preparation: Fix the PCB board on the rework platform and position the laser red dot at the center of the BGA chip.
2,Start Soldering: Set the temperature, switch to welding mode, and click start. The heating head will automatically lower. After contacting the BGA chip, it will rise by 2-3mm and then start heating.
3,Completion: After the temperature curve is completed, the heating head will automatically rise to the initial position. Soldering is now complete.
