BGA Rework System Computer Repair Machine

Optical alignment - prism imaging and LED lighting are adopted through the optical module to adjust the light field distribution so that the image of a small chip is displayed on the display to achieve optical alignment and repair. To talk about Non-optical alignment is to align BGA with the PCB screen line and point by the naked eye to achieve alignment repair.

The intelligent operation equipment for visual alignment, welding, and disassembly of BGA elements of different sizes can effectively improve the productivity of repair rate and greatly reduce the cost.

At present, there are three heating modes in the repair system: up hot air + down infrared, up and down infrared and up and down hot air. At present, there is no final conclusion about which way is the best. Some of the production principles of the upper hot air are fans, some are air pumps, and the latter is relatively better. At present, infrared heating is mainly far-infrared, because the length of the far-infrared wave is invisible light, not sensitive to color, basically the same absorption and refractive index of different substances, so it is better than infrared heating. A kind of In hot air reflow soldering, the bottom of PCB must be able to be heated. The purpose of this heating is to avoid warping and deformation caused by single-side heating of PCB and to shorten the melting time of solder paste. This bottom heating is particularly important for BGA rework of large size plates. A kind of There are three heating modes at the bottom of BGA repair equipment: one is hot air heating, the other is infrared heating, and the third is hot air + infrared heating. The advantage of hot air heating is even heating, which is recommended for the general repair process. The disadvantage of infrared heating is uneven heating of PCB. Now, hot air + infrared is

widely used in China.

Instrument control, low repair rate, easy to burn BGA chip, especially lead-free BGA. Compared with some high-end repair tables, there are PLC control and full computer control.

Choose a good hot air return nozzle. The hot air return nozzle belongs to non-contact heating. During heating, the solder of each solder joint on BGA is melted at the same time by high-temperature airflow. It can ensure a stable temperature environment in the whole reflux process and protect the adjacent devices from being damaged by the convective hot air. Success depends on the uniformity of heat distribution on the package and PCB pad, without blowing or moving the components in the reflow. A kind of The heat resistance temperature of most semiconductor devices in BGA repair process is 240. C ~ 600. C. For BGA repair system, the control of heating temperature and uniformity is very important. In the repair case, the heat convection transfer includes blowing out the heated air through the nozzle, which has the same shape as the element. The airflow is dynamic, including laminar effect, high and low-pressure area and circulation speed. When these physical effects are combined with heat absorption and distribution, it is clear that the construction of hot air nozzles for local area heating, as well as the correct BGA repair, is a complex task. Any pressure fluctuation or the problem of compressed air source or pump required by hot air system will fundamentally reduce the performance of the machine.

Effective time: DH-A2 produced by Shenzhen Dinghua Technology Development CO, Ltd. The big bottom of the utility model adopts infrared heating, which is composed of six groups of infrared heating pipes; the small bottom adopts infrared heating wind; the upper part adopts hot air heating, which is composed of a group of heating wire winding and high-pressure gas pipe. The control system adopts PLC mode, which can store 200 temperature curves.