Cellphone Repair BGA Soldering Table Equipment

Cellphone Repair BGA Soldering Table Equipment

Operation Demo:

Cellphone Repair BGA Soldering Table Equipment" refers to specialized tools and workstations used for soldering and reworking BGA (Ball Grid Array) components in cellphone repairs. BGA is a type of surface-mount packaging used for integrated circuits (ICs), commonly found in cellphones.

Desoldering BGA Ball and tin

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (L*W*H)
10	Net weight	70 Kg

Applications:

Characteristic:

Cellphone Repair BGA Soldering Table Equipment is designed to work with various sizes of BGA, QFP, and other components. It features an advanced optical system called "SPLIT VISION" and a precise positioning soldering system, allowing you to easily and safely replace any component. The built-in LCD monitor enables accurate adjustment of the soldering position on the board.

Packing List :

Materials: Strong wooden case+wooden bars+proof pearl cottons with film

• 1pc Cellphone Repair BGA Soldering Table Equipment
• 1pc brush pen
• 1pc Instruction Manual
• 1pc CD video
• 3pcs top nozzles
• 2pcs bottom nozzles
• 6pcs universal fixtures
• 6pcs fastened screws
• 4pcs support screw
• Sucker size: Diameters in 2,4,8,10,11mm
• Inner hexagon spanner: M2/3/4
• Dimension: 81*76*85CM
• Gross weight: 115 kg

 

Specification:

 

Total Power	5200W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd IR heater 2700W
Voltage	AC220V/110V±10％ 50Hz
Feeding system	Auto feeding system for chip
Operation mode	Two modes: manual and automatic, free choose! HD touch screen, intelligent human-machine, digital system setting.
Temperature profile storage	50,000 groups(un-limited number of groups)
Optical CCD camera lens	Automatic stretching out and folding to pick and place BGA chip
Camera magnification	1.8 million pixels
Workbench fine-tuning:	±15mm forward/backward, ±15mm right/left
Placement accuracy:	±0.015mm
Bga positioning	Laser positioning, fast and accurate position of PCB and BGA
PCB position	Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov pcb bracket + universal fixtures.
Lighting	Taiwan led working light, any angle adjustable
Temperature control	K sensor, close loop, PLC control
Temp accuracy	±2℃
PCB size	Max 450×400 mm Min 22×22 mm
BGA chip	1x1 - 80x80 mm
Minimum chip spacing	0.015mm
External temper sensor	1pc
Dimensions	L740×W630×H710 mm
Net weight	70KG