Hot Air BGA Re-work Station Repairing

                                                                                  Macbook Cpu repairing tool Kits DH-A2E

A hot air BGA rework station is a piece of equipment used to repair ball grid array (BGA) components on printed 

circuit boards (PCBs). The station consists of a heating element that uses hot air to melt the existing solder on the 

BGA component, making it easier to remove from the PCB. The hot air BGA rework station can also be used to place 

a new BGA component onto the PCB by reflowing the solder using the heating element.

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver  + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (L*W*H)
10	Net weight	70 Kg

 

Applications:

The process of repairing a BGA component using a hot air BGA rework station involves several steps. First, 

the existing solder on the BGA component is melted using hot air, allowing the component to be removed from

 the PCB. The area around the BGA component is then cleaned to remove any remaining solder or debris.

Once the area is clean, a new BGA component is placed onto the PCB, and the solder is reflowed using the hot air 

BGA rework station. The temperature and airflow of the heating element is carefully adjusted to ensure that the

 solder is melted evenly and the BGA component is firmly attached to the PCB.

Fully Automatic Soldering Robot System DH-A2E 

DH-A2E  is controlled through a user-friendly touchscreen. Its ergonomically designed instrument panel includes 

joystick control for both camera zoom and, when the system is in manual mode, vertical control of the upper heater 

and placement head. 

Dial adjustments control component and PCB lighting as well as air flow from the upper heater, precise control of 

which can prevent the shifting of small chips during reflow. 

The rework station's panel also includes a built-in K-type thermocouple input and a USB port for exporting solder 

temperature profiles to a flash drive.

Overall, the hot air BGA rework station is a valuable tool for repairing complex electronic devices and can help extend 

the lifespan of expensive equipment by allowing faulty components to be replaced instead of discarding the entire device.

Packing List :

Materials: Strong wooden case+wooden bars+proof pearl cottons with film

1pc Macbook Cpu repairingTool Kits

1pc brush pen

1pc Instruction Manual

1pc CD video

3pcs top nozzles

2pcs bottom nozzles

6pcs universal fixtures

6pcs fastened screws

4pcs support screw

Sucker size: Diameters in 2,4,8,10,11mm

Inner hexagon spanner: M2/3/4

Dimension:81*76*85CM

Gross weight: 115 kg