Automatic Reballing Infrared Bga Repair Machine
1. Hot-air for soldering and desoldering, IR for preheating. 2. Upper air-flow adjustable. 3. As many temperature profiles can be saved as you want. 4. Laser-point which makes positioning much faster.
Description
Automatic reballing infrared bga repair machine
Operation guide for the BGA rework station DH-A2
DH-A2 consists of a vision system for aligning, operation system for time and temperature,etc. setting and safe system, which can maximize its functions, also simplify its maintenance, to make an end-user better experience.
1. Application of Automatic reballing infrared bga repair machine
To solder, reball, desolder a different kind of chips:
BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chips, and so on.
2. Product Features
* Stable and long lifespan(designed for 15 years using)
* Can repair different motherboards with high successful rate
* Strictly control heating and cooling temperature
* Optical alignment system: mounting accurately within 0.01mm
* Easy to operation. Anyone can learn to use it in 30 minutes. No special skill is needed.
3. Specification of Automatic reballing infrared bga repair machine
| Power supply | 110~240V 50/60Hz |
| Power rate | 5400W |
| Auto level | solder, desolder, pick up and replace, etc. |
| Optical CCD | automatic with a chip feeder |
| Running control | PLC (Mitsubishi) |
| chip spacing | 0.15mm |
| Touchscreen | curves appearing, time and temperature setting |
| PCBA size available | 22*22~400*420mm |
| chip size | 1*1~80*80mm |
| Weight | about 74kg |
4. Details of Automatic reballing infrared bga repair machine
1. Top hot-air and a vacuum sucker installed together, which is conveniently picking up a chip/component for aligning.
2. Optical CCD with a split vision for those dots on a chip vs motherboard imaged on a monitor screen.
3. The display screen for a chip(BGA,IC,POP and SMT,etc.) vs its matched motherboard's dots aligned before soldering.
4. 3 heating zones, upper hot-air, lower hot-air and IR preheating zones, which can be used for small to iPhone motherboard, also, up to computer ann TV mainboards, etc.
5. IR preheating zone covered by steel-mesh, which makes heating elements evenly and safer.
6. Operation interface for time and temperature setting, temperature profiles can be stored as many as 50,000 groups.
5. Why Choose Our Automatic SMD SMT LED BGA Workstation?
6. Certificate of BGA rework system computer repair machine
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.
7. Packing & Shipment of Automatic BGA rework reballing machine
8. Shipment for the BGA rework station
DHL, TNT, FEDEX, SF, Sea transportation and other special lines,etc.. If you want another shipping term, please tell us.
We will support you.
9. Terms of Payment
Bank transfer, Western Union, Credit Card.
Please tell us if you need other support.
10. The relevant knowledge for automatic reballing infrared BGA repair machine
1. Classification of Repair Machines
Optical Alignment: Optical alignment is achieved through the use of prism imaging and LED lighting in the optical module. This setup adjusts the light field distribution, allowing the image of a small chip to be displayed on the screen for precise optical alignment and repair.
Non-Optical Alignment: Non-optical alignment involves manually aligning the BGA with the PCB's screen lines and points using the naked eye to achieve alignment and repair. Intelligent equipment for visual alignment, welding, and disassembly of BGA elements of different sizes can significantly improve repair productivity and reduce costs.
2. Heating Modes
Currently, there are three heating modes in the repair system: top hot air + bottom infrared, top and bottom infrared, and top and bottom hot air. There is no definitive conclusion on which mode is the best. The top hot air system can be driven by either fans or air pumps, with air pumps generally being superior. Infrared heating, particularly far-infrared, is often preferred because far-infrared waves are invisible light, not sensitive to color, and have consistent absorption and refractive indices across different materials, making it more effective than standard infrared heating. In hot air reflow soldering, it's crucial that the bottom of the PCB is heated to prevent warping and deformation due to single-side heating and to shorten the solder paste melting time. This bottom heating is especially important for BGA rework on large boards. The three bottom heating modes for BGA repair equipment are hot air, infrared, and hot air + infrared. Hot air heating provides even heating and is generally recommended, while infrared heating can result in uneven PCB heating. The hot air + infrared combination is now widely used in China.
3. Control Modes
There are different control modes in BGA repair machines, including instrument control, which has a low repair rate and risks burning BGA chips, especially lead-free ones. In comparison, high-end repair machines may use PLC control or full computer control for more precise operations.
4. Selection of Air Nozzles
Choose a good hot air reflow nozzle, as it provides non-contact heating. During heating, the solder at each joint on the BGA melts simultaneously due to the high-temperature airflow, ensuring a stable temperature environment throughout the reflow process and protecting adjacent components from convective hot air damage. Success depends on the uniformity of heat distribution on the package and PCB pad, without disturbing the components during reflow.
Most semiconductor devices used in the BGA repair process have a heat resistance temperature between 240°C and 600°C. For BGA repair systems, controlling the heating temperature and ensuring uniformity is crucial. Heat convection transfer involves blowing heated air through a nozzle shaped like the element being repaired. The airflow dynamics, including laminar effects, high and low-pressure areas, and circulation speed, combined with heat absorption and distribution, make constructing hot air nozzles for localized heating and ensuring proper BGA repair a complex task. Any fluctuation in pressure or issues with the compressed air source or pump can significantly reduce the machine's performance.
5. Introduction to Existing Machines
The DH-A2, produced by Shenzhen Dinghua Technology Development Co., Ltd., is a notable example. The large bottom of this machine uses infrared heating, consisting of six groups of infrared heating pipes, while the small bottom uses infrared heating wind. The upper part uses hot air heating, composed of a heating wire coil and a high-pressure gas pipe. The control system operates in PLC mode and can store up to 200 temperature curves.
Advantages:
a. It uses three independent heating bodies, two of which can heat in sections; one is for constant temperature heating, with the option to turn off five heating bodies to reduce power consumption.
b. The optical alignment system allows for more convenient and faster alignment operations.
c. The PCB support frame features positioning holes for quicker and easier PCB fixing, especially for irregularly shaped boards.
d. The use of three independent heating bodies results in a faster temperature rise slope, better meeting lead-free process requirements.
e. The upper temperature control uses external air pressure, providing a stable air pressure source and ensuring uniform temperature distribution.
f. The touch screen interface allows for real-time adjustment of the temperature curve, making operation more convenient.
que puede almacenar 200 curvas de temperatura.
