Infrared Soldering Station BGA Machine For Laptop

Infrared soldering station BGA machine for laptop

IR & hot-air for hybrid-heating which is much better for a big(more than 100*100mm) motherboard being soldering, desoldering and preheated, widely used in factories, Lab and repair shops, etc. 

1. Application of Infrared soldering station BGA machine for laptop

To solder, reball, desolder a different kind of chips: 

BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chips, and so on.

2. Product Features of Infrared soldering station BGA machine for laptop

* Stable and long lifespan(designed for 15 years using)

* Can repair different motherboards with high successful rate

* Strictly control heating and cooling temperature

* Optical alignment system: mounting accurately within 0.01mm

* Easy to operation. Anyone can learn to use it in 30 minutes. No special skill is needed.

3. Specification of Infrared soldering station BGA machine for laptop

4. Details of Infrared soldering station BGA machine for laptop

1. Top hot-air and a vacuum sucker installed together, which is conveniently picking up a chip/component for aligning.

2. Optical CCD with a split vision for those dots on a chip vs motherboard imaged on a monitor screen.

3. The display screen for a chip(BGA,IC,POP and SMT,etc.) vs its matched motherboard's dots aligned before soldering.

4. 3 heating zones, upper hot-air, lower hot-air and IR preheating zones, which can be used for small to iPhone motherboard, also, up to computer ann TV mainboards, etc. 

5. IR preheating zone covered by steel-mesh, which makes heating elements evenly and safer.

6. Operation interface for time and temperature setting, temperature profiles can be stored as many as 50,000 groups.

5. Why Choose Our Infrared soldering station BGA machine for laptop? 

6. Certificate of Infrared soldering station BGA machine for laptop

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7. Packing & Shipment of Infrared soldering station BGA machine for laptop

8. Shipment for the BGA rework station

DHL, TNT, FEDEX, SF, Sea transportation and other special lines,etc.. If you want another shipping term, please tell us. 

We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. Operation guide for the BGA rework station DH-A2

11. The relevant knowledge for automatic reballing infrared BGA repair machine

                                              Basic knowledge of BGA repair station

1.The principle of the common hot air SMD repair system is: using very fine hot air flow to gather on the pins and pads of SMD to melt the solder joints or reflow the solder paste to complete the disassembly or welding function. A vacuum mechanical device equipped with a spring and a rubber suction nozzle is used at the same time for disassembly. When all welding spots are melted, the SMD device is gently sucked up. The hot airflow of the hot air SMD repair system is realized by replaceable hot air nozzles of different sizes. Because the hot air flow comes out from the periphery of the heating head, it will not damage the SMD, the substrate or the surrounding components, and it is easy to disassemble or weld the SMD.         

The difference of repair systems from different manufacturers is mainly due to different heating sources or different hot airflow modes. Some nozzles make the hot airflow around and at the bottom of the SMD device, and some nozzles only spray the hot air above the SMD. From the point of view of protection devices, it is better to choose airflow around and at the bottom of SMD devices. In order to prevent the PCB warpage, it is necessary to choose a repair system with a preheating function at the bottom of the PCB.         

Since the solder joints of BGA are invisible at the bottom of the device, the rework system is required to be equipped with light splitting vision system (or bottom reflection optical system) when re-welding BGA, so as to ensure the accurate alignment when mounting BGA. For example, Dinghua Technology, DH-A2, DH-A5 and DH-A6,etc. 

2.BGA repair steps

The BGA repair steps are basically the same as the traditional SMD repair steps. The specific steps are as follows:

1. Remove BGA

(1) place the surface assembly plate to be disassembled on the worktable of the rework system.         

(2) select the square hot air nozzle matching the size of the device, and install the hot air nozzle on the connecting rod of the upper heater. Pay attention to the stable installation

(3) buckle the hot air nozzle on the device, and pay attention to the uniform distance around the device. If there are elements around the device that affect the operation of the hot air nozzle, remove these elements first, and then weld them back after repair.         

(4) select the suction cup (nozzle) suitable for the device to be disassembled, adjust the height of the vacuum negative pressure suction pipe device of the suction device, lower the top surface of the suction cup to contact the device, and turn on the vacuum pump switch.

（5） When setting the disassembly temperature curve, it should be noted that the disassembly temperature curve must be set according to the size of the device, the thickness of the PCB and other specific conditions. Compared with the traditional SMD, the disassembly temperature of BGA is about 150 ℃ higher.         

(6) turn on the heating power and adjust the hot air volume.         

(7) when the solder melts completely, the device is absorbed by the vacuum pipette.         

(8) lift up the hot air nozzle, close the vacuum pump switch, and catch the disassembled device.         

2. Remove residual solder on PCB pad and clean this area

(1) Clean and level the residual solder of PCB pad with soldering iron, and use the unwelded braid belt and flat spade shaped soldering iron head for cleaning. Pay attention not to damage the pad and solder mask during operation.         

(2) clean the flux residue with cleaning agent such as isopropanol or ethanol.         

3. Dehumidification treatment

Because PBGA is sensitive to moisture, it is necessary to check whether the device is damped before assembly, and dehumidify the damped device.         

(1) dehumidification treatment methods and requirements:

After unpacking, check the humidity display card attached to the package. When the indicated humidity is more than 20% (read when it is 23 ℃ ± 5 ℃), it indicates that the device has been damped, and the device needs to be dehumidified before mounting. The dehumidification can be carried out in an electric blast drying oven and baked for 12-20h at 125 ± ℃.         

(2) precautions for dehumidification:

(a) the device shall be stacked in a high-temperature resistant (greater than 150 ℃) antistatic plastic tray for baking.         

(b) the oven shall be well grounded, and the wrist of the operator shall be equipped with an anti-static bracelet with good grounding.

(1) Pulire e livellare la saldatura residua del pad PCB con saldatore e utilizzare la cinghia a treccia non saldata e la testa piatta del saldatore a forma di forcella per la pulizia. Prestare attenzione a non danneggiare il cuscinetto e la maschera di saldatura durante il funzionamento.

(2) pulire il residuo di flusso con un detergente come isopropanolo o etanolo.

3. Trattamento di deumidificazione

Poiché PBGA è sensibile all'umidità, è necessario verificare se il dispositivo è smorzato prima del montaggio e deumidificare il dispositivo smorzato.

(1) metodi e requisiti per il trattamento della deumidificazione:

Dopo il disimballaggio, controllare la scheda di visualizzazione dell'umidità allegata alla confezione. Quando l'umidità indicata è superiore al 20% (leggere quando è di 23 ℃ ± 5 ℃), indica che il dispositivo è stato smorzato e che il dispositivo deve essere deumidificato prima del montaggio. La deumidificazione può essere eseguita in un forno elettrico per asciugatura e cotta per 12-20 ore a 125 ± ℃.

(2) precauzioni per la deumidificazione:

a) il dispositivo deve essere impilato in un vassoio di plastica antistatica resistente alle alte temperature (superiore a 150 ℃) per la cottura.

(b) il forno deve essere ben collegato a terra e il polso dell'operatore deve essere dotato di un braccialetto antistatico con una buona messa a terra