Mobile Ic Automatic Reballing Machine
1.HD CCD optical alignment system for positioning 2.superior safety function with emergency protection 3.top heating head and mounting head 2 in 1 design 4.top air flow adjustable to meet the demand of any chips
Description
Mobile ic automatic reballing machine
A mobile IC automatic reballing machine is a device used for repairing or replacing the integrated circuits (IC) on a
mobile phone’s motherboard. It is an efficient and cost-effective way to fix the damaged ICs without replacing the
entire motherboard, cutting down the repair time and cost for the technician.
The reballing machine uses different processes such as preheating, fluxing, alignment, reflow, and cooling to repair
or replace the IC on the mobile device. The process involves removing the damaged IC from the motherboard, clea-
ning the area, aligning new balls made of a special alloy to the exact position of the removed IC, and then soldering
the new IC onto the motherboard.
The automatic reballing machine saves time and reduces the risk of damage to the motherboard as it is designed to
do this automatically, ensuring that the reballing process is carried out efficiently.
In summary, the mobile IC automatic reballing machine is an essential tool for mobile phone repair technicians, as it
speeds up the repair process and saves cost by repairing the motherboard rather than replacing it completely.
| Total power | 5500W |
| 3 independent heaters | Top hot-air 1200w, lower hot-air 1200w, bottom infrared preheating 3000w |
| Voltage | 110~240V +/-10% 50/60Hz |
| Electric parts | 7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning |
| Temperature control | K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy y within ±2℃. |
| PCB positioning | V-groove + universal fixture + movable PCB shelf |
| Applicable PCB size | Max 370x410mm Min 22x22mm |
| Applicable BGA size | 1*1mm~80x80mm |
| Dimensions | 600x700x850mm (L*W*H) |
| Net weight | 70 Kg |
Advanced Features
① Top hot airflow is adjustable, to meet the demand of any chips.
② Desoldering, mounting and soldering automatically.
③ Built-in laser positioning, help fast positioning for PCB.
④ Infrared heating system with three independent heaters.
⑤ Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
⑥ build-in vacuum in mounting head picks up BGA chip automatically after desoldering is completed.
1. Machine:1 set
2. All packed in stable and strong wooden cases, suitable for import and export.
3. Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm)
Bottom nozzle:2pcs(34*34mm,55*55mm)
4. Beam:2 pcs
5. Plum knob: 6 pcs
6. Universal fixture:6 pcs
7. Support screw:5 pcs
8. Brush pen:1 pcs
9. Vacuum cup:3 pcs
10. Vacuum needle:1 pcs
11. Tweezer:1 pcs
12. Temp sensor wire:1 pcs
13. Professional Instruction Book:1 pcs
14. Teaching CD: 1 pcs
