BGA Rework Station For Mobile

                                                    DH-A2 BGA rework station for mobile

The BGA rework station for mobile phone repair is designed to repair PCBs in mobile phones. This station is used to replace components such as integrated circuits, CPUs, graphic processors, and other electronic parts on the PCB board. It can also be used to remove or replace faulty components. Features include adjustable temperature and air pressure, an automatic solder feeder, and high-precision placement frames.

The parameter of DH-A2 BGA rework station for mobile

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                                         The details of the illustration for BGA rework station

Advanced Features

① Top hot-airflow is adjustable, to meet the demand of any chips.
② Desoldering, mounting and soldering automatically.
③ Built-in laser positioning, help fast positioning for a PCBa.
④ Infrared heating system with three independent heaters.

⑤ Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
⑥ build-in vacuum in mounting head picks up BGA chip automatically after desoldering completed.

1. Machine:1 set
2. All packed in stable and strong wooden cases, suitable for import and export.
3. Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm)
Bottom nozzle:2pcs(34*34mm,55*55mm)
4. Beam:2 pcs
5. Plum knob: 6 pcs
6. Universal fixture:6 pcs
7. Support screw:5 pcs
8. Brush pen:1 pcs
9. Vacuum cup:3 pcs
10. Vacuum needle:1 pcs
11. Tweezer:1 pcs
12. Temp sensor wire:1 pcs
13. Professional Instruction Book:1 pcs
14. Teaching CD: 1 pcs

A Few Common Questions on How to Set Temperatures for a BGA Rework Station for Mobile Devices:

1,Excess Flux and Contamination: There is too much flux on the BGA surface, and the steel mesh, solder balls, and ball placement table are not clean or dry.

2,Storage Conditions: The solder paste and solder balls are not stored in a refrigerator at 10°C. The PCB and BGA may have moisture and have not been baked.

3,PCB Support Card: When soldering the BGA, if the PCB support card is too tight, there is no space for thermal expansion, which can cause deformation and damage to the board.

4,Difference Between Leaded and Lead-Free Solder: Leaded solder melts at 183°C, while lead-free solder melts at 217°C. Leaded solder has better fluidity, while lead-free solder is less fluid but environmentally friendly.

5,Cleaning the Infrared Heating Plate: The dark infrared heating plate at the bottom should not be cleaned with liquid substances. Use a dry cloth and tweezers for cleaning.

6,Adjusting Temperature Curves: If the measured temperature does not reach 150°C after the second stage (heating stage) ends, the target temperature in the second stage temperature curve can be increased, or the constant temperature time can be extended. Generally, the temperature measurement should reach 150°C after completing the second curve run.

7,Maximum Temperature Tolerance: The maximum temperature that the BGA surface can withstand is less than 250°C for leaded solder (standard is 260°C) and less than 260°C for lead-free solder (standard is 280°C). Refer to the customer's BGA specifications for precise information.

8,Reflow Time Adjustment: If the reflow time is too short, increase the constant temperature time of the reflow section moderately and extend the time as needed.

Although setting the temperature curve for the BGA rework station can be complex, it only needs to be tested once. After saving the temperature curve, it can be reused multiple times. Patience and careful attention during the setting process are essential to ensure the BGA rework station is configured correctly, thereby ensuring a high rework yield.