BGA Rework Soldering Station

BGA rework soldering station

1.Application Of Optical Alignment BGA Reballing Station

Can repair the motherboard of a computer, smartphone, laptop, MacBook logic board, digital camera, air conditioner, TV and other electronic equipment from the medical industry, communication industry, automobile industry, etc.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of Optical Alignment BGA Reballing Station

Vacuum-pen installed upper nozzles, which is convenient for picking up, replacing and desoldering, etc.

Monitor screen, 1080P, 15 inches, which is used for aligning showed on.

2 hot-air heaters and 1 infrared preheating zone, the hot-air heaters for soldering and desoldering, the infrared preheating 

for a big motherboard to be preheated so that making the motherboard protected.

Imported LED light, 10W, which is bright enough for a big PCB to be seen clearly.

The steel-mesh enclosure is installed above the infrared preheating zone, which can make operators protected from being injured,

also for small components not dropping inside, even though heating evenly. 

* High successful rate of chip-level repairing. Precise temperature control and precise alignment of every soldering joint.

* 3 independent heating areas ensure precise temperature. Deviation with ± 1ºC. You can set different temperature profiles on the screen based on different motherboards.

* 600 million pix Panasonic original CCD camera ensures precise alignment of every soldering joints.

* Easy to operation. No special skill is needed.

3.Specification of Optical Alignment BGA Reballing Station

4. Why Choose Our Optical Alignment BGA Reballing Station? 

5.Certificate of Optical Alignment BGA Reballing Station

To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO.,LTD was the first to pass UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

6.Packing & Shipment of Optical Alignment BGA Reballing Station

7.Shipment for Optical Alignment BGA Reballing Station

We will ship the machine via DHL/TNT/FEDEX. If you want other shipping terms, please tell us. We will support you.

8. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. Small tips for Optical Alignment BGA  and manual BGA rework station:

The BGA desoldering process is profound and subtle, so it is necessary to master appropriate skills and steps in order to have a good effect. Before welding BGA chips, in order to remove moisture, PCB and BGA should be baked in a constant temperature oven at 80ml 90 ℃ for 20 hours. Adjust the baking temperature and time according to the degree of moisture. PCB and BGA without unpacking can be welded directly. It is important to pay special attention to wearing electrostatic rings or antistatic gloves when doing all of the following operations to avoid possible damage to the BGA chip.
Before welding the BGA chip, the BGA chip should be accurately aligned on the PCB pad. There are two methods that can be used: optical alignment and manual alignment. At present, manual alignment is mainly used, that is, the screen printing lines around the BGA and the pad on the PCB are aligned.
The technique of BGA and PCB alignment: in the process of aligning BGA and silkscreen, even if the solder ball deviates from the pad by about 30%, it can still be welded if it is not fully aligned. Because in the process of melting, the tin ball will automatically align with the pad because of the tension between it and the tin pad. After the alignment operation is completed, place the PCB on the bracket of the BGA return table and secure it so that it is level with the BGA return table. Select the appropriate hot air nozzle (that is, the size of the nozzle is slightly larger than BGA), then select the corresponding temperature curve, start the welding, wait for the completion of the temperature curve, cooling, then complete the BGA welding.
In the process of production and debugging, it is inevitable to replace the BGA due to BGA damage or other reasons. The BGA repair table can also disassemble the BGA. Disassembly of BGA can be regarded as the reverse process of welding BGA. The difference is that after the temperature curve is finished, the BGA should be sucked away with a vacuum pen, and other tools, such as tweezers, are not used to avoid damaging the pad by exerting too much force. The PCB of the removed BGA is used to remove tin while it is hot, so why should it be operated while it is hot? Because the hot PCB is equivalent to the function of preheating, it can ensure that the work of removing tin is easier. The tin suction line is used here, do not use too much force in the operation, so as not to damage the pad, after ensuring that the pad on PCB is flat, you can enter the welding operation of BGA.
The removed BGA can be welded again. But the ball needs to be implanted before welding again. The purpose of planting the ball is to replant the tin ball on the pad of the BGA, which can achieve the same arrangement as the new BGA.
With the above skills of the BGA welding and disassembly process, there will be fewer detours on the way of welding growth, and the results will be faster and more efficient. I hope the experience sharing in this article will give you some inspiration for BGA welding and disassembly.