BGA Chip Reballing And Rework

BGA Chip Reballing And Rework

BGA Chip Reballing And Rework DH-A2 with high successful rate of repairing. Welcome to order.

Description

                                                             Automatic BGA Chip Reballing And Rework

Automatic BGA Chip Reballing and Rework is a process that uses a machine to remove and replace faulty or damaged

 ball grid array (BGA) chips on printed circuit boards (PCBs). The machine is equipped with a heating element, a soldering

 tool, and a vacuum system that are used in conjunction to remove and replace the chips.

SMD Hot Air Rework Station

SMD Hot Air Rework Station

1.Application Of laser positioning BGA Chip Reballing And Rework

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, 

PBGA,CPGA,LED chip.

DH-G620 is totally same as DH-A2, automatically desoldering, pick-up, puting back and soldering for a chip, with optical alignment for mounting,no matter whether you have experience or not, you can master it in one hour.

 

DH-G620

2.Specification of DH-A2 BGA Chip Reballing And Rework

power 5300W
Top heater Hot air 1200W
Bottom heater Hot air 1200W.Infrared 2700W
Power supply AC220V±10% 50/60Hz
Dimension L530*W670*H790 mm
Positioning V-groove PCB support, and with external universal fixture
Temperature control K type thermocouple, closed loop control, independent heating
Temperature accuracy ±2℃
PCB size Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning ±15mm forward/backward,±15mm right/left
BGAchip 80*80-1*1mm
Minimum chip spacing 0.15mm
Temp Sensor 1(optional)
Net weight 70kg

 

3.Details of Automatic BGA Chip Reballing And Rework

ic desoldering machine

chip desoldering machine

pcb desoldering machine

 

4.Why Choose Our BGA Chip Reballing And Rework Split Vision

motherboard desoldering machinemobile phone desoldering machine

 

5.Certificate of BGA Chip Reballing And Rework

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has 

passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

 

6. Shipment for BGA Chip Reballing And Rework

DHL/TNT/FEDEX. If you want another shipping term, please tell us. We will support you.

 

7. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

 

11. Related knowledge

What is the temperature resistance of a PCB circuit board? How do you test the heat resistance of a PCB circuit board?

These are common questions from customers. The following information will provide a detailed answer.

First: What is the maximum temperature resistance of a PCB circuit board, and what is the duration of that temperature resistance?

The maximum temperature resistance of a PCB board is 300 degrees Celsius for 5-10 seconds. For lead-free wave soldering, the temperature is about 260 degrees Celsius, while for lead solder, it is 240 degrees Celsius.

Second: Heat Resistance Test

Preparation: Circuit board production board

1.Sample five 10x10 cm substrates (or plywood, finished boards); ensure they have copper substrates without blistering or delamination:

  • Substrate: 10 cycles or more
  • Plywood: Low CTE, 150, 10 cycles or more
  • HTg material: 10 cycles or more
  • Normal material: 5 cycles or more
  • Finished board:

    Low CTE, 150: 5 cycles or more

    HTg material: 5 cycles or more

    Normal material: 3 cycles or more

2.Set the temperature of the tin furnace to 288 ± 5 degrees Celsius and use contact temperature measurement for calibration.

3.First, use a soft brush to apply flux to the surface of the board. Then, use tongs to place the test board into the tin furnace. After 10 seconds, remove it and cool it to room temperature. Visually check for any bubble bursts; this counts as one cycle.

4.If foaming or bursting is observed during the visual inspection, stop the immersion tin analysis and immediately begin the explosion point failure mode (F/M) analysis. If no issues are detected, continue the cycles until the bursting occurs, with 20 cycles as the endpoint.

5.Any bubbles need to be sliced for analysis to identify the source of initiation points, and photographs should be taken.

This introduction provides basic knowledge about temperature and heat resistance testing for PCB circuit boards. We hope it helps everyone. We will continue to share more technical knowledge and new information regarding PCB circuit board design, production, and more. If you want to know more about PCB circuit board knowledge, please continue to follow this site.

 

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