SMD Soldering Equipment Automatic Reballing Replace

1. Application Of laser positioning

Work with all kinds of motherboards or PCBA.

Solder, reball, and desoldering different kinds of chips: BGA, PGA,POP, BQFP,QFN, SOT223,PLCC, TQFP,TDFN, TSOP, 

PBGA, CPGA,LED chip.

 

2. Product Features of Optical Alignment 

 

3.Specification of DH-A2

Power	5300w
Top heater	Hot air 1200w
Bottom heater	Hot air 1200W. Infrared 2700w
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	Ktype thermocouple,closed loop control,independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm, Min 22 *22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGA chip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

 

4. Details

 

5.Why Choose Our SMD Soldering Equipment Automatic Reballing Replace Split Vision? 

 

6.Certificate 

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua 

has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

 

7. Packing & Shipment

 

 

8. Shipment

DHL/TNT/FEDEX. If you want another shipping term, please tell us. We will support you.

 

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

 

10. How does DH-A2 SMD Soldering Equipment Automatic Reballing Replace work?

 

 

11. Related Knowledge

The more troublesome aspect of solder mask fabrication is the solder mask treatment, which is performed via:

In addition to the conductive function of the via, many PCB design engineers will design it as the finished test point for the product after assembly, and in some cases, it may even be designed as a component insertion hole. In the case of conventional via design, the purpose is to prevent solder from flowing into the hole during the soldering process. If the via is used as a test point or a component insertion hole, the window must be opened.

However, the tin-plated over-hole cover oil can easily cause tin beads to form inside the hole. Therefore, a considerable portion of the product is designed with a via plug to address this issue. This treatment is also applied to facilitate packaging the BGA position. However, when the hole diameter exceeds 0.6mm, it increases the difficulty of plugging (the plug may not fill the hole completely). As a result, the tin-plated hole is often designed with a half-open window, which has a larger diameter than the single hole (0.065mm), and the hole wall and edge are within the 0.065mm range, then sprayed with tin.

Character processing mainly involves adding pads and related marks to the characters.

As component layouts become denser, it is necessary to ensure that the character does not overlap with the pad. At a minimum, the distance between the character and the pad should be at least 0.15mm. Additionally, the component frame and symbol may not always be perfectly distributed across the circuit board. Most of the film layout is completed by the machine, so if adjustments cannot be made during design, you can consider printing only the character box without printing the component symbol.

Common marks include supplier identification, UL demonstration mark, flame retardant grade, anti-static mark, production cycle, customer-specified logo, and others. It is important to clarify the meaning of each logo, and it is best to designate and specify their locations.

Jigsaw and Shape Production Considerations

The jigsaw must first be designed for easy processing. The time interval for electric milling should be determined based on the diameter of the milling cutter (commonly 1.6mm, 1.2mm, 1.0mm, or 0.8mm). When designing the shape of the punched plate, attention should be paid to whether the distance between the hole and the edge of the plate is greater than the plate thickness. The minimum groove size should be greater than 0.8mm. If V-CUT is used, the edge line and copper layer must be at least 0.3mm away from the center of the V-CUT.

Additionally, the issue of material utilization must be considered. Since the specifications for bulk material purchases are relatively fixed, common sheet materials come in sizes such as 930x1245mm, 1040x1245mm, and 1090x1245mm. If the delivery unit is unreasonable, it can lead to significant material waste.