Optical Alignment BGA Reballing Station
1. Dinghua DH-A2 Automatic Optical Alignment BGA Reballing Station
2. Directly from factory
3. Largest manufacturer of automatic BGA rework station in China
Description
An Optical Alignment BGA Reballing Station is a specialized equipment used to repair or refurbish
Ball Grid Array (BGA) chips on electronic circuit boards. BGA chips are tiny components that are
soldered onto a circuit board, and they often fail due to various reasons such as heat, physical stress, and
external factors, if have no professional equipment.

The Optical Alignment BGA Reballing Station allows precise alignment of the BGA chip during reballing.
Reballing involves removing the faulty BGA chip from the board, cleaning the solder pads, and then soldering
a new BGA chip onto the cleaned pads. The reballing process is critical because it requires extreme precision to
ensure that the new chip is aligned correctly on the board.

1. Application
Can repair motherboards of computers, smartphones, laptops, MacBook logic boards, digital cameras,air conditioners, TV and
other electronic equipment from the medical industry, communication industry, automobile industry, etc.
Solder, reball, and desoldering different kinds of chips: BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA,
CPGA, LED chip.
3. Specification
The Optical Alignment BGA Reballing Station uses high-resolution cameras to capture images of the BGA pads
and the new chip. The system then analyzes the images and uses sophisticated algorithms to align the two
components precisely. The technician can see a real-time preview of the alignment on a screen and make adjustments
as needed.
| Power | 5300w |
| Top heater | Hot air 1200w |
| Bottom heater | Hot air 1200W. Infrared 2700w |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | Ktype thermocouple,closed loop control,independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm, Min 22 *22 mm |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| BGA chip | 80*80-1*1mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(optional) |
| Net weight | 70kg |
4. Details
Optical Alignment BGA Reballing Station improves the efficiency and quality of the reballing process. It saves time
and reduces the possibility of errors during alignment. The result is a reliable repair or refurbishing job that restores
the functionality of the electronic device.


5. Why Choose Our Optical Alignment BGA Reballing Station?

6. Certificate
To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD was the first to pass UL,
E-MARK, CCC, FCC, and CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed
ISO, GMP, FCCA, and C-TPAT on-site audit certifications.

7. Packing & Shipment

10. Operation guide












