Optical Alignment BGA Reballing Station
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Optical Alignment BGA Reballing Station

Optical Alignment BGA Reballing Station

1. Dinghua DH-A2 Automatic Optical Alignment BGA Reballing Station
2. Directly from factory
3. Largest manufacturer of automatic BGA rework station in China

Description

An Optical Alignment BGA Reballing Station is a specialized equipment used to repair or refurbish 

Ball Grid Array (BGA) chips on electronic circuit boards. BGA chips are tiny components that are 

soldered onto a circuit board, and they often fail due to various reasons such as heat, physical stress, and 

external factors, if have no professional equipment.

optical alignment bga reballing station

The Optical Alignment BGA Reballing Station allows precise alignment of the BGA chip during reballing. 

Reballing involves removing the faulty BGA chip from the board, cleaning the solder pads, and then soldering 

a new BGA chip onto the cleaned pads. The reballing process is critical because it requires extreme precision to

ensure that the new chip is aligned correctly on the board.

automatic bga reballing station

1. Application 

Can repair motherboards of computers, smartphones, laptops, MacBook logic boards, digital cameras,air conditioners, TV and 

other electronic equipment from the medical industry, communication industry, automobile industry, etc.

Solder, reball, and desoldering different kinds of chips: BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA,

CPGA, LED chip.

 

3. Specification

 

The Optical Alignment BGA Reballing Station uses high-resolution cameras to capture images of the BGA pads 

and the new chip. The system then analyzes the images and uses sophisticated algorithms to align the two 

components precisely. The technician can see a real-time preview of the alignment on a screen and make adjustments

 as needed.

Power 5300w
Top heater Hot air 1200w
Bottom heater Hot air 1200W. Infrared 2700w
Power supply AC220V±10% 50/60Hz
Dimension L530*W670*H790 mm
Positioning V-groove PCB support, and with external universal fixture
Temperature control Ktype thermocouple,closed loop control,independent heating
Temperature accuracy ±2℃
PCB size Max 450*490 mm, Min 22 *22 mm
Workbench fine-tuning ±15mm forward/backward,±15mm right/left
BGA chip 80*80-1*1mm
Minimum chip spacing 0.15mm
Temp Sensor 1(optional)
Net weight 70kg

 

4. Details 

Optical Alignment BGA Reballing Station improves the efficiency and quality of the reballing process. It saves time 

and reduces the possibility of errors during alignment. The result is a reliable repair or refurbishing job that restores 

the functionality of the electronic device.

ic desoldering machine

chip desoldering machine

 

 

5. Why Choose Our Optical Alignment BGA Reballing Station? 

mobile phone desoldering machine

 

6. Certificate 

To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD was the first to pass UL, 

E-MARK, CCC, FCC, and CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed 

ISO, GMP, FCCA, and C-TPAT on-site audit certifications.

pace bga rework station

 

7. Packing & Shipment 

Packing Lisk-brochure

 

 

10. Operation guide

 

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