Mobile IC Reballing Machine

 Mobile IC Reballing Machine for iPhone, Huawei, Samsung, LG, etc.

The widespread use of modern mobile devices has greatly enhanced convenience for users. However, it has also raised the requirements for mobile phone and PCB repair professionals.

To better serve these devices, we have introduced the Mobile IC Reballing Machine, designed to provide efficient and reliable BGA and IC repair for mobile devices and PCBs. This machine is characterized by its efficiency and fast operation, helping technicians complete mobile device repairs more effectively.

For various brands of mobile devices, such as iPhone, Huawei, Samsung and LG, the Mobile IC Reballing Machine offers practical advantages for BGA and IC repair. It is suitable for different BGA and IC package sizes and supports repeated repair operations.

The machine can automatically perform major rework processes such as desoldering, chip pick-up, alignment, placement and soldering. Temperature and working time can be set according to different repair requirements, helping improve operation safety and repair consistency.For IC reballing, the removed chip normally needs to be reballed with suitable stencils, solder balls or solder paste before it is aligned and soldered back onto the PCB.

 

 

 

 

• Automatic desoldering, chip pick-up, mounting and soldering.
• CCD camera ensures precise alignment between the BGA/IC and PCB pads.
• Three independent heating zones ensure precise and stable temperature control.
• The multi-hole hot-air heating design is especially useful for large PCBs and BGA chips located in the center of the PCB, helping reduce cold soldering and chip drop problems.
• The bottom hot-air heater can reach up to 300°C, which is especially useful for large motherboards. The upper heater can work synchronously or independently according to the repair requirements.

 

DH-G620 has similar automatic functions to DH-A2, including chip desoldering, pick-up, placement and soldering, with optical alignment for accurate mounting. Its automatic operation helps reduce the difficulty of BGA rework for both experienced technicians and new operators.

 

 

 

Power	5300W
Top heater	Hot air 1200W
Bollom heater	Hot air 1200W, Infrared 2700W
Power supply	AC220V± 10% 50/60Hz
Dimension	L530*W670*H790 mm
Posilioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple. closed loop control. independent heating
Temperalure accuracy	±2℃
PCB size	Max 450*490 mm, Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward, ±15mm righ/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(opional)
Net weight	70kg

 

 

 

 

 

 

 

 

 

 

 

 

 

To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD was

the first to pass UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect

the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

 

 

 

 

 Email: john@dh-kc.com

WhatsApp/Wechat/Mob:+86 157 6811 4827

 

 

BGA Rework Operation Tips

(1). BGA preparation before desoldering.

Set the appropriate desoldering temperature, heating time and airflow according to the PCB size, BGA package and solder type. Fix the mobile phone PCB securely on the repair platform before heating.

(2). Desoldering

In the BGA board repair technology, remember the direction and positioning of the chip before unsoldering.
If there is no printed positioning frame on the PCB, mark it around with a marker, inject a small amount of flux at the bottom of the BGA, and select a suitable BGA. Select a suitable BGA hot-air nozzle according to the chip size.
Align the handle vertically with the BGA, but note that the nozzle must be about 4mm away from the compon-ent. Start the desoldering process using the preset temperature, time and airflow parameters.

After the desoldering, the BGA component is removed with a suction pen after 2 seconds, so that the original solder ball can be evenly distributed on the pads of the PCB and the BGA, which is advantageous for the subs-equent BGA soldering. If there is a surplus of tin on the PCB pad, use an anti-static soldering station to handle it evenly. If it is severely connected, you can apply flux again and reheat the PCB carefully, and finally make the tin package neat and smooth. The tin on the BGA is completely removed by a solder strip through an antistatic soldering station. Pay attention to anti-static and do not over-tempera-ture, otherwise, it will damage the pad or even the motherboard.

(3). Cleaning of BGA and PCB.

Clean the PCB pads and the removed BGA carefully using suitable PCB cleaning solution. Remove remaining solder and flux residues before the next reballing or soldering process.

(4). BGA Chip Reballing

BGA chip reballing normally requires a suitable laser-cut reballing stencil matched to the BGA package. The stencil holes should be clean and uniform so that solder paste or solder balls can be applied evenly to the BGA pads.

(5). Welding of BGA chips.

Apply a suitable amount of flux to the BGA solder balls and PCB pads. Place the BGA according to the original position mark. At the same time of w-elding, the BGA can be bonded and positioned to prevent it from being blown away by hot air, but care should be taken not to put too much flux, otherwise, the chip will be displaced due to excessive bubbles generated by the rosin. The PCB board is also placed in an anti-static maintenance station and fixed with a universal tip and placed  horizontally. The parameters of the intelligent desolder are preset to a temperature of 260 ° C ~ 280 ° C, welding  time: 20 seconds, the airflow parameters are unchanged. Align the hot-air nozzle with the BGA chip and maintain a suitable distance according to the nozzle and process requirements before starting the soldering process. As the BGA solder ball melts and the PCB pad forms a better tin alloy soldering, and the surface tension of the solder ball causes the chip to be automatically centered even if it is originally deviated from the mainboard so that it is done. Note that the BGA cannot be applied during the we-lding process. Even if the wind pressure is too high, a short circuit will occur between the solder balls under the BGA.

Note: Actual temperature, heating time and airflow settings should be adjusted according to PCB size, component type, solder alloy and repair conditions. Avoid excessive heating to prevent PCB or pad damage.