Mobile IC Reballing Machine

           Mobile IC Reballing Machine for iPhone, Huawei, Samsung, LG, etc.

The widespread use of modern mobile devices has greatly enhanced convenience and enjoyment for users. However, it has also raised the bar for mobile maintenance professionals.

To better serve these devices, we have introduced the Mobile IC Heavy Ball Machine for the first time, enabling high-quality maintenance services. This device is characterized by its efficiency and speed, allowing for fast and effective mobile device repairs.

For various brands of mobile devices, such as iPhone, Huawei, Samsung, LG, etc., the IC Mobile Heavy Ball Machine offers unique advantages. It is compatible with processors of different packaging types, supports repeated operations, and can be fully cleaned and dried, even in situations where flat welded steel is prone to damage, without the need for disassembly. The machine automatically adjusts the temperature and working time as required. This ensures operational safety while improving sales revenue and customer satisfaction.

The IC Mobile Heavy Ball Machine also provides professional after-sales service.

 

Demo video of DH-A2E automatic repair station:

 

1. Product Features 

• Desoldering, mounting and soldering automatically.

•CCD Camera ensure precise alignment of every soldering joint,

•Three independent heating zones ensure precise temperature control.

•Hot air multi-hole round center support is especially useful for big-size PCB and BGA

located in the center of PCB. Avoid cold soldering and IC-drop situation.

•The temperature profile of bottom hot air heater can reach as high as 300°C, critical for

big size motherboard. Meanwhile, the upper heater could be set as synchronized or ind-

ependent work.

 

DH-G620 is totally same as DH-A2, automatically desoldering, pick-up, puting back and soldering for a chip, with optical alignment for mounting,no matter whether you have experience or not, you can master it in one hour.

2.Specification 

Power	5300W
Top heater	Hot air 1200W
Bollom heater	Hot air 1200W, Infrared 2700W
Power supply	AC220V± 10% 50/60Hz
Dimension	L530*W670*H790 mm
Posilioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple. closed loop control. independent heating
Temperalure accuracy	±2℃
PCB size	Max 450*490 mm, Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward, ±15mm righ/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(opional)
Net weight	70kg

3.Details of Mobile IC Reballing Machine

4.Why Choose Our Mobile IC Reballing Machine?

 

5.Certificate 

To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD was

the first to pass UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect

the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

6.Packing & Shipment of Mobile IC Reballing Machine

7.Contact for Mobile IC Reballing Machine

 Email: john@dh-kc.com

WhatsApp/Wechat/Mob:+86 157 6811 4827

8.Related knowledge

BGA maintenance operation skills

(1). BGA preparation before desoldering.

Set the parameter status of SUNKKO 852B to temperature 280 °C ~ 310 °C; desoldering time: 15 seconds;

airflow parameters: × × × (1~9 files can be preset by user code);

Finally, the desolder is set to the automatic mode state, and the SUNKKO 202 BGA anti-static tin-plating

repair station is used to mount the mobile phone PCB board with the universal tip and fix it on the main-

tenance platform.

(2). Desoldering

In the BGA board repair technology, remember the direction and positioning of the chip before unsoldering.

If there is no printed positioning frame on the PCB, mark it around with a marker, inject a small amount of flux

at the bottom of the BGA, and select a suitable BGA. The size of the BGA special welding nozzle is mounted

on the 852B.

Align the handle vertically with the BGA, but note that the nozzle must be about 4mm away from the compon-

ent. Press the start button on the 852B handle. The desolder will automatically untwist with the preset parame-

ters.

After the desoldering, the BGA component is removed with a suction pen after 2 seconds, so that the original

solder ball can be evenly distributed on the pads of the PCB and the BGA, which is advantageous for the subs-

equent BGA soldering. If there is a surplus of tin on the PCB pad, use an anti-static soldering station to handle

it evenly. If it is severely connected, you can apply the flux again on the PCB, and then start the 852B to warm

the PCB again, and finally make the tin package neat and smooth. The tin on the BGA is completely removed

by a solder strip through an antistatic soldering station. Pay attention to anti-static and do not over-tempera-

ture, otherwise, it will damage the pad or even the motherboard.

(3). Cleaning of BGA and PCB.

Clean the PCB pad with high-purity wash water, use an ultrasonic cleaner (with anti-static device) to fill the

wash water, and clean the removed BGA.

(4). BGA chip planting tin.

BGA chip tinning must use a laser-punched steel sheet with a single-sided horn-type mesh. The thickness of

the steel sheet is required to be 2mm thick, and the whole wall is required to be smooth and tidy. The lower

part of the horn hole (contacting a face of BGA) should be compared. The top (scraping into the small hole) is

10μm~15μm. (The above two points can be observed by a ten-fold magnifying glass), so that the printing paste

can easily fall onto the BGA.

(5). Welding of BGA chips.

Apply a small amount of thick flux to the BGA solder balls and PCB pads (high purity is required, add active rosin

to the analytical pure alcohol to dissolve), and retrieve the original mark to place the BGA. At the same time of w-

elding, the BGA can be bonded and positioned to prevent it from being blown away by hot air, but care should be

taken not to put too much flux, otherwise, the chip will be displaced due to excessive bubbles generated by the

rosin. The PCB board is also placed in an anti-static maintenance station and fixed with a universal tip and placed

horizontally. The parameters of the intelligent desolder are preset to a temperature of 260 ° C ~ 280 ° C, welding

time: 20 seconds, the airflow parameters are unchanged. The automatic soldering button is triggered when the

BGA nozzle is aligned with the chip and leaves 4mm. As the BGA solder ball melts and the PCB pad forms a better

tin alloy soldering, and the surface tension of the solder ball causes the chip to be automatically centered even if

it is originally deviated from the mainboard so that it is done. Note that the BGA cannot be applied during the we-

lding process. Even if the wind pressure is too high, a short circuit will occur between the solder balls under the BGA.