Semi-auto Optical BGA Rework Station
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Semi-auto Optical BGA Rework Station

Semi-auto Optical BGA Rework Station

1. Product Introduction New definition of board repair - automatic, flexible and process reliable! · Highly efficient 1200 W hybrid heating head, large-area IR bottom heating with 3 heating zones 3000W) · Automatic and precise component alignment with the help of machine...

Description

                                                       Semi-auto Optical BGA Rework Station

 

1. Product Introduction

A new definition of board repair: automatic, flexible, and process-reliable!

  • Highly efficient 1200 W hybrid heating head
  • Homogeneous, large-area IR bottom heating with 3 heating zones (800 W each)
  • Automatic and precise component alignment with the help of machine vision
  • Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)
  • User-independent, reproducible repair results guaranteed
  • Process control and documentation via the operator software HRSoft
  • Fully automatic or semi-automatic operation
  • Suitable for use with the Dip&Print Station

 

2. Product Specifications

Dimensions (W x D x H) in mm

660 * 620 * 850mm

Weight in kg

70 kg

Antistatic Design (y/n)

y

Power Rating in W

5300W

Nominal voltage in V/AC

110~220V   50/60Hz

Upper heating

Hot air 1200W

Lower heating

Hot air 1200W

Preheating area

Infrared 2700W, size:250 x 330mm

PCB size in mm

from 20*20~370*450 mm

Component size in mm

from 1*1 80*80

Operation

7-inch built-in touch screen, 800*480 resolution

Test symbol

CE

 

3. Product Applications

Desoldering, placement, and soldering of all types of surface-mounted devices (SMD): BGA, metallic BGA, CGA, 

BGA socket, QFP, PLCC, MLF, and miniature components with an edge length of up to 1 x 1 mm.

 

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4. Product details

 

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5. Product Qualifications

 

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6. Our Services

To support our customers, we provide Gold Standard Sales and Technical Support services from our Dinghua offices.

Our highly trained engineers are experienced in all types of rework applications and can assist with processes, nozzles, stencils, spares, and customization.

7. FAQ

Q: How does the Dinghua BGA rework machine control temperature? Will the machine get too hot and damage the PCB or chip?

A: The Dinghua BGA rework machine can heat the PCB and BGA chips simultaneously. The third IR heater preheats the PCB from the bottom evenly to avoid PCB deformation during the repair process. All three heaters can be controlled independently.

It uses a K-type thermocouple with closed-loop control and a PID automatic temperature compensation system, together with a PLC and temperature module, to ensure precise temperature control with a deviation of ±2°C.

Q: How does the Dinghua BGA rework machine guarantee safety to protect the operator in case of an emergency?

A: The machine is CE certified and is equipped with an emergency button. Additionally, there is a voice warning that activates about 5 seconds before the soldering/desoldering process is complete. It also features an automatic power-off protection system in the event of an abnormal incident, with double over-heating protection controls.

 

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