BGA Workstation Hot Air Automatic

BGA Workstation Hot Air Automatic

1.Application Of laser positioning BGA Workstation Hot Air Automatic

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of Optical Alignment BGA Workstation Hot Air Automatic

3.Specification of DH-A2 BGA Workstation Hot Air Automatic

4.Details of Infrared BGA Workstation Hot Air Automatic

5.Why Choose Our BGA Workstation Hot Air Automatic Split Vision? 

6.Certificate of CCD Camera BGA Workstation Hot Air Automatic

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7.Packing & Shipment of BGA Workstation Hot Air Automatic

8.Shipment for BGA Workstation Hot Air Automatic

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. How does DH-A2 BGA Workstation Hot Air Automatic work?

11. Related knowledge

PCB circuit board composition

Pattern and Pattern: The line is used as a tool for conducting conduction between the originals. The design will additionally design a large copper surface as the grounding and power supply layer. The line and the drawing are made at the same time.

Dielectric: used to maintain the insulation between the circuit and the layers, commonly known as the substrate.

Through hole / via: The via hole can make the two levels above the line conduct each other, the larger via hole is used as the component insert, and the non-via hole (nPTH) is usually used as the surface mount. Positioning and fixing screws for assembly.

Solder resistant /Solder Mask: Not all copper surfaces should be tinned. Therefore, non-tin-stained areas will be printed with a layer of copper-free material (usually epoxy) to avoid Short circuit between lines that are not tinned. According to different processes, it is divided into green oil, red oil and blue oil.

Legend /Marking/Silk screen: This is a non-essential structure. The main function is to mark the name and position frame of each part on the circuit board to facilitate post-assembly maintenance and identification.

Surface Finish: Since the copper surface is easily oxidized in a general environment, it is impossible to apply tin (poor solderability), so it is protected on the copper surface where tin is to be eaten. The protection methods include spray coating (HASL), gold (ENIG), silver (Immersion Silver), tin (Immersion Tin), and organic solder resist (OSP). The methods have their own advantages and disadvantages, collectively referred to as surface treatment.

PCB board appearance

Bare boards (with no parts on top) are also often referred to as "Printed Wiring Boards (PWB)". The substrate of the board itself is made of a material that is insulated and heat-insulating and is not easily bent. The thin circuit material that can be seen on the surface is copper foil. The original copper foil is covered on the whole board, and part of the manufacturing process is etched away, and the remaining part becomes a mesh-like small line. . These lines are called conductor patterns or wires and are used to provide electrical connections to the parts on the PCB.

Usually the color of the PCB board is green or brown, which is the color of the solder mask. It is an insulating protective layer that protects copper wires and prevents short circuits caused by wave soldering, and saves solder usage. A layer of silk screen is also printed on the solder mask. Text and symbols (mostly white) are usually printed on this to indicate the position of each part on the board. The screen printing surface is also referred to as the legend.

In the final product, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components are mounted. By connecting wires, electronic signal connections and organic energy can be formed.