Industrial X-ray Inspection System

 

The industrial X-ray inspection system DH-X9 is designed to provide precise internal inspection for electronic components and PCBs. As an advanced offline X-ray solution, it allows operators to detect hidden defects without damaging the product. By using Non-destructive Testing, the system can clearly identify issues such as solder voids, short circuits, misalignment, and internal structural defects.

 

This industrial X-ray inspection system is widely used in SMT production lines, laboratories, and quality control departments. With high-resolution imaging and user-friendly operation, the offline X-ray machine helps engineers quickly analyze internal structures and improve production reliability. Through Non-destructive Testing, manufacturers can ensure product quality, reduce failure risks, and enhance inspection efficiency.

 

 

 

 

 

Whole Machine's Status
Dimension	1475 ×1465 ×1930mm		Power-supply	AC220V/10A
Weight	Approx 2100KG		Gross weight	Approx 2500KG
Packed	1650 ×1650 ×2200mm		Power	1.9KW
Door opened	Automatic		Detection Method	Off
Uploading	Manual		Authorization	Passwords

 

 

Xray Tube
Xray Tube	Closed-type		Currency	200ɥA
Xray source	40-130KV		Focus size	5um
Cooling way	wind-cooling		Geometric magnification	300x

 

 

 

 

 

SMT Assembly Inspection: In Surface Mount Technology, X-ray is the only reliable way to inspect hidden solder joints. This is critical for packages like BGA (Ball Grid Array), QFN, and LGA, where the connections are located underneath the component body and cannot be seen by standard cameras.

Quality Control (QC): Machines are used to ensure every board meets industry standards (like IPC-A-610). They specifically look for:
* Solder Voids: Trapped air bubbles that weaken electrical and thermal conductivity.
* Bridging: Unintended solder connections that cause short circuits.
* Solder Shorts/Splashes: Excess metal debris that could lead to failure.

Failure Analysis: When a product fails in the field, X-ray is used to identify the root cause without destroying the board. It can find internal cracks in solder joints, broken wire bonds inside ICs, or delamination between PCB layers.

Counterfeit Component Detection: By comparing the internal "die" and wire-bonding patterns of a chip to a known authentic sample, X-ray can identify fake or refurbished semiconductors.

Through-Hole Fill Verification: For power electronics, X-ray measures the barrel fill of solder in through-holes to ensure a strong mechanical bond.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Found in 2011, Shenzhen Dinghua Technology Development CO.,LTD has been focusing on the R&D and production of X-RAY counting machines,X-ray NDT machines, BGA rework stations, and automated production equipment. The company takes "research and development as the foundation, quality as the core, and service as the guarantee" and is committed to creating "professional equipment, professional quality, and professional service"! At the same time, the company adheres to the development concept of "professionalism, integrity, innovation, and pragmatism" and has established a professional technical research and development team. It constantly absorbs and draws on domestic and foreign industry development experience, boldly explores, introduces new ideas, and realizes the transformation from traditional hardware combination to integration. The second revolution in the control industry, becoming a pioneer and leader in X-ray counting or NDT, BGA rework stations, and automation production equipment industries.